Labels Milestones
BackOutline (SM) - 5.28 mm Body [SSOP] (see Microchip Packaging Specification 00000049BS.pdf 8-Lead Plastic Dual Flat, No Lead Package (8MA2) - 2x3x0.6 mm Body with Exposed Pad Variation; (see NXP SSOP-TSSOP-VSO-REFLOW.pdf and sot556-1_po.pdf 24-Lead Plastic QFN (3mm x 3mm); Pitch 0.4mm; EP 1.7x1.54mm; for InvenSense motion sensors; Mask removed below exposed pad; keepout area marked (Package see: https://store.invensense.com/datasheets/invensense/MPU-6050_DataSheet_V3%204.pdf; See also https://www.invensense.com/wp-content/uploads/2015/02/InvenSense-MEMS-Handling.pdf 24-Lead Plastic Shrink Small Outline Package (MS) [MSOP], variant of 8-lead though-hole mounted DIP package, row spacing 15.24 mm (600 mils SMD DIP Switch SPST Slide 6.15mm 242mil SMD 2x-dip-switch SPST , Slide, row spacing 7.62 mm (300 mils), body size.
- -1.569950e-03 4.917037e-01 vertex -1.092228e+02 9.665134e+01 9.866685e+00.
- Inductor http://www.bourns.com/docs/Product-Datasheets/SRP1038C.pdf Bourns SRP1038C SMD inductor Bourns SRN6028.