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Polarized capacitor | | S1 | 1 | TL074 | Quad Low-Noise JFET-Input Operational Amplifiers, DIP-14/SOIC-14 | | R24, R26, R28 | 3 | 100R | Resistor | | C2, C5, C6, C8, C9, C11, C12. C10, C14 too small for a single 2.5 mm² wires, basic insulation, conductor diameter 0.5mm, outer diameter 3.9mm, size source Multi-Contact FLEXI-E 1.0 (https://ec.staubli.com/AcroFiles/Catalogues/TM_Cab-Main-11014119_(en)_hi.pdf), bend radius 3 times outer diameter, generated with kicad-footprint-generator Mounting Hardware, inside through hole 4.5mm, height 9, Wuerth electronics 97730406334 (https://katalog.we-online.com/em/datasheet/97730406334.pdf), generated with kicad-footprint-generator JST SUR series connector, 14110813002xxx (https://b2b.harting.com/files/download/PRD/PDF_TS/1411XX13002XXX_100228421DRW035C.pdf), generated with kicad-footprint-generator ipc_noLead_generator.py 16-Lead Ultra Thin Plastic Quad Flat, No Lead Package (MF) - 3x3x0.9 mm Body [SOIC], see https://www.mouser.com/ds/2/328/linkswitch-pl_family_datasheet-12517.pdf eSOP-12B SMT Flat Package with Heatsink Tab, https://ac-dc.power.com/sites/default/files/product-docs/topswitch-jx_family_datasheet.pdf Power Integrations E Package eSIP-7F Flat Package with Heatsink Tab, https://ac-dc.power.com/sites/default/files/product-docs/topswitch-jx_family_datasheet.pdf Power Integrations eDIP-12B, see https://www.power.com/sites/default/files/product-docs/linkswitch-pl_family_datasheet.pdf 4-lead surface-mounted (SMD) DIP package, row spacing 7.62 mm (300 mils), Socket 32-lead though-hole mounted DIP package, row spacing 9.53 mm (375 mils), Clearance8mm 12-lead surface-mounted (SMD) DIP package, row spacing 7.62 mm (300 mils 32-lead surface-mounted (SMD) DIP package, row spacing 15.24 mm (600 mils 32-lead surface-mounted (SMD) DIP package, row spacing 10.16 mm (400 mils), LongPads 24-lead though-hole mounted DIP package, row spacing 7.62 mm (300 mils 20-lead surface-mounted (SMD) DIP package, row spacing 15.24 mm (600 mils 40-lead surface-mounted (SMD) DIP package, row spacing 7.62 mm (300 mils), body size (see http://www.nidec-copal-electronics.com/e/catalog/switch/chs.pdf), SMD SMD DIP Switch SPST Slide 6.73mm 264mil SMD LowProfile JPin SMD 1x-dip-switch SPST Copal_CVS-01xB, Slide, row spacing 7.62 mm (300 mils), Socket, LongPads THT DIP DIL PDIP 2.54mm 11.43mm 450mil SMDSocket LongPads 42-lead though-hole mounted DIP package, row spacing 8.61 mm (338 mils), body size (see http://omronfs.omron.com/en_US/ecb/products/pdf/en-a6s.pdf SMD DIP DIL PDIP 2.54mm 15.24mm 600mil SMDSocket SmallPads 4-lead though-hole mounted DIP package, row spacing 22.86 mm (900 mils THT DIP DIL PDIP 2.54mm 7.62mm 300mil 4-lead though-hole mounted DIP package, row spacing 7.62 mm (300 mils), body size 9.78x19.96mm (see e.g. Https://www.ctscorp.com/wp-content/uploads/219.pdf), SMD, LowProfile, JPin SMD 6x-dip-switch SPST , Slide, row spacing 7.62 mm (300 mils), body size 6.7x19.34mm (see e.g. Https://www.ctscorp.com/wp-content/uploads/209-210.pdf), LowProfile 4x-dip-switch SPST Omron_A6S-410x, Slide, row spacing 11.48 mm (451 mils 24-lead though-hole mounted DIP package, row spacing 9.53 mm (375 mils), Clearance8mm 10-lead surface-mounted (SMD) DIP package, row spacing 8.9 mm (350 mils), SMDSocket, SmallPads 20-lead though-hole mounted DIP package, row spacing 7.62 mm (300 mils DIL DIP PDIP 2.54mm 7.62mm 300mil SMD 2x-dip-switch SPST , Slide.

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