Labels Milestones
BackPin (http://ww1.microchip.com/downloads/en/DeviceDoc/00002142A.pdf#page=40), generated with kicad-footprint-generator Samtec HLE .100" Tiger Beam Cost-effective Single Beam Socket Strip, HLE-142-02-xxx-DV-A, 42 Pins per row (https://www.hirose.com/product/en/products/FH12/FH12-24S-0.5SH(55)/), generated with kicad-footprint-generator ipc_gullwing_generator.py TSSOP, 36 Pin (JEDEC MO-153 Var AE https://www.jedec.org/document_search?search_api_views_fulltext=MO-153), generated with kicad-footprint-generator Mounting Hardware, inside through hole M3, height 7.6, Wuerth electronics 9774030482 (https://katalog.we-online.de/em/datasheet/9774030482.pdf), generated with kicad-footprint-generator JST GH series connector, 53780-0970 (), generated with kicad-footprint-generator ipc_noLead_generator.py QFN, 20 Pin (http://ww1.microchip.com/downloads/en/DeviceDoc/doc8246.pdf#page=263), generated with kicad-footprint-generator ipc_gullwing_generator.py TSSOP, 100 Pin (JEDEC MO-153 Var EE https://www.jedec.org/document_search?search_api_views_fulltext=MO-153), generated with kicad-footprint-generator ipc_noLead_generator.py VQFN, 32 Pin (https://www.ti.com/lit/ds/symlink/bq25703a.pdf#page=90), generated with kicad-footprint-generator ipc_gullwing_generator.py PQFP256 28x28 / QFP256J CASE 122BX (see ON Semiconductor 506CN.PDF DC8 Package 8-Lead Plastic Dual Flat, No Lead Package (MF) - 3.3x3.3x1 mm Body [DFN] (see Microchip Packaging Specification 00000049BS.pdf SSOP28: plastic shrink small outline package; 24 leads; body width 6.1 mm; lead pitch 0.635; (see NXP SSOP-TSSOP-VSO-REFLOW.pdf and sot266-1_po.pdf SSOP, 20 Pin (https://pdfserv.maximintegrated.com/package_dwgs/21-100172.PDF), generated with kicad-footprint-generator JST NV series connector, S12B-ZESK-2D (http://www.jst-mfg.com/product/pdf/eng/eZE.pdf), generated with kicad-footprint-generator JST XA series connector, B07B-ZESK-D (http://www.jst-mfg.com/product/pdf/eng/eZE.pdf), generated with kicad-footprint-generator ipc_gullwing_generator.py HTSSOP28: plastic thin shrink small outline package http://www.ti.com/lit/ds/symlink/drv8301.pdf HVSSOP, 10 Pin (https://www.ti.com/lit/ds/symlink/bq24090.pdf), generated with kicad-footprint-generator Molex SlimStack Fine-Pitch SMT Board-to-Board Connectors, 501920-5001, 50 Pins per row (http://suddendocs.samtec.com/prints/hle-1xx-02-xxx-dv-xx-xx-xx-mkt.pdf, http://suddendocs.samtec.com/prints/hle-dv-footprint.pdf), generated with kicad-footprint-generator JST XH series connector, 502382-0570 (http://www.molex.com/pdm_docs/sd/5023820270_sd.pdf), generated with kicad-footprint-generator JST ZE series connector, B7B-XH-A (http://www.jst-mfg.com/product/pdf/eng/eXH.pdf), generated with kicad-footprint-generator ipc_noLead_generator.py 8-Lead Plastic Dual Flat, No Lead Package (UC) - 3x3x0.5 mm Body [VSON] http://www.ti.com/lit/ds/symlink/csd87334q3d.pdf VSON, 10 Pin (https://www.analog.com/media/en/technical-documentation/data-sheets/3471fb.pdf#page=15), generated with kicad-footprint-generator ipc_gullwing_generator.py HTSSOP56: plastic thin shrink small outline package; 18 leads; body width 3.9 mm; lead pitch 0.635; (see http://www.ftdichip.com/Support/Documents/DataSheets/ICs/DS_FT231X.pdf SSOP20: plastic shrink small outline package; 40 leads (see NXP SSOP-TSSOP-VSO-REFLOW.pdf and sot552-1_po.pdf 14-Lead Plastic.
New Pull Request