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8x9 raster, 3.767x4.229mm package, pitch 0.8mm; see section 7.1 of http://www.st.com/resource/en/datasheet/stm32f103tb.pdf LFBGA-144, 12x12 raster, 10x10mm package, 0.5mm pitch; https://www.xilinx.com/support/documentation/user_guides/ug475_7Series_Pkg_Pinout.pdf#page=267, NSMD pad definition Appendix A BGA 484 0.8 SBG485 SBV485 LFCSP, exposed pad, thermal vias, DDA0008J (http://www.ti.com/lit/ds/symlink/tps5430.pdf 8-pin HTSOP package with 1.27mm pin pitch, compatible with SOIC-8, 3.9x4.9mm² body, exposed pad, thermal vias, DDA0008J (http://www.ti.com/lit/ds/symlink/tps5430.pdf Texas Instruments HSOP 9, 1.27mm pitch, double cols (from Kicad 4.0.7), script generated Through hole angled pin header, 2x14, 2.54mm pitch, DIN 41651 / IEC 60603-13, double rows latches, https://docs.google.com/spreadsheets/d/16SsEcesNF15N3Lb4niX7dcUr-NY5_MFPQhobNuNppn4/edit#gid=0 Through hole straight socket strip, 1x16, 1.27mm pitch, 4.0mm pin length, single row Through hole vertical IDC box header THT 2x35 1.00mm double row surface-mounted straight socket strip, 2x02, 2.54mm pitch, DIN 41651 / IEC 60603-13, double rows, 12.0mm latches, mounting holes, https://docs.google.com/spreadsheets/d/16SsEcesNF15N3Lb4niX7dcUr-NY5_MFPQhobNuNppn4/edit#gid=0 Through hole straight socket strip, 1x07, 2.00mm pitch, double rows Through hole angled socket strip, 1x03, 2.00mm pitch, double rows Surface mounted pin header SMD 1x21 2.00mm single row Through hole angled socket strip THT 1x20 2.54mm single row Through hole straight socket strip, 2x07, 2.54mm pitch, 6mm pin length, single row style1 pin1 left Surface mounted pin header SMD 1x07 2.00mm single row (https://gct.co/files/drawings/bc065.pdf), script generated Through hole horizontal IDC header THT 2x18 1.27mm double row Through hole socket strip THT 2x17 1.00mm double row surface-mounted straight socket strip.