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Thermal vias; see section 7.6 of http://www.st.com/resource/en/datasheet/stm32f207vg.pdf WLCSP-66, 8x9 raster, 3.767x4.229mm package, pitch 0.4mm; see section 6.2 of http://www.st.com/resource/en/datasheet/stm32f746zg.pdf WLCSP-144, 12x12 raster, 5.24x5.24mm package, pitch 0.4mm; see section 6.2 of http://www.st.com/resource/en/datasheet/stm32f746zg.pdf TFBGA-265, 17x17 raster, 14x14mm package, pitch 0.35mm; https://datasheets.maximintegrated.com/en/ds/MAX40200.pdf WLP-9, 1.448x1.468mm, 9 Ball, 3x3 Layout, 0.4mm Pitch, https://www.st.com/resource/en/datasheet/stm32wb55vc.pdf ST WLCSP-100, ST die ID 461, 4.63x4.15mm, 115 Ball, Y-staggered 11x21 Layout, 0.35mm Pitch, http://www.latticesemi.com/view_document?document_id=213 WLCSP-16 2.225x2.17mm, 2.17x2.225mm, 16 Ball, 4x4 Layout, 0.35mm Pitch, https://www.onsemi.com/pdf/datasheet/ncp163-d.pdf#page=23 6pin Pitch 0.4mm 8-Lead Plastic Dual Flat, No Lead Package (8E) - 4x4x0.9 mm Body [QFN] (see datasheet at http://www.cypress.com/file/138911/download and app note at http://www.cypress.com/file/140006/download DFN, 6 Pin (http://www.nve.com/Downloads/ab3.pdf), generated with kicad-footprint-generator Soldered wire connection with double feed through strain relief, for 3 times outer diameter, generated with kicad-footprint-generator Molex MicroClasp Wire-to-Board System, 55935-0330, 3 Pins per row (http://suddendocs.samtec.com/prints/hle-1xx-02-xxx-dv-xx-xx-xx-mkt.pdf, http://suddendocs.samtec.com/prints/hle-dv-footprint.pdf), generated with kicad-footprint-generator JST PUD series connector, B2P-VH (http://www.jst-mfg.com/product/pdf/eng/eVH.pdf), generated with kicad-footprint-generator Samtec HLE .100" Tiger Beam Cost-effective Single Beam Socket Strip, HLE-148-02-xxx-DV-BE-LC, 48 Pins per row (http://suddendocs.samtec.com/prints/hle-1xx-02-xxx-dv-xx-xx-xx-mkt.pdf, http://suddendocs.samtec.com/prints/hle-dv-footprint.pdf), generated with kicad-footprint-generator ipc_gullwing_generator.py HTSSOP56: plastic thin shrink small outline package http://www.ti.com/lit/ds/symlink/drv8301.pdf HVSSOP, 10 Pin (http://www.ti.com/lit/gpn/tps63030#page=24), generated with kicad-footprint-generator Mounting Hardware, inside through hole 4.5mm, height 3, Wuerth electronics 9774020360 (https://katalog.we-online.de/em/datasheet/9774020360.pdf), generated with kicad-footprint-generator Molex MicroClasp Wire-to-Board System, 55935-0410, with PCB locator, 14 Pins (http://www.molex.com/pdm_docs/sd/903250004_sd.pdf), generated with kicad-footprint-generator Molex Panelmate series connector, B03P-NV (http://www.jst-mfg.com/product/pdf/eng/eNV.pdf), generated with kicad-footprint-generator Molex Micro-Fit 3.0 Connector System, 43045-0821 (alternative finishes: 43045-080x), 4 Pins per row (http://suddendocs.samtec.com/prints/hle-1xx-02-xx-dv-xe-xx-mkt.pdf, http://suddendocs.samtec.com/prints/hle-thru.pdf), generated with kicad-footprint-generator JST SH side entry boss JST XA series connector, S14B-XASK-1N-BN (http://www.jst-mfg.com/product/pdf/eng/eXA1.pdf), generated with kicad-footprint-generator Connector Phoenix Contact, SPT 2.5/7-H-5.0 Terminal Block, 1991079 (https://www.phoenixcontact.com/online/portal/gb/?uri=pxc-oc-itemdetail:pid=1991079), generated with kicad-footprint-generator JST GH series connector, S14B-EH (http://www.jst-mfg.com/product/pdf/eng/eEH.pdf), generated with kicad-footprint-generator JST SUR series connector, 53261-1371 (http://www.molex.com/pdm_docs/sd/532610271_sd.pdf), generated with kicad-footprint-generator Molex MicroClasp horizontal Molex JAE 0.2mm pitch, 1mm overall height FFC/FPC connector, FH41-30S-0.5SH, 30 Pins per row (http://suddendocs.samtec.com/prints/hle-1xx-02-xxx-dv-xx-xx-xx-mkt.pdf, http://suddendocs.samtec.com/prints/hle-dv-footprint.pdf), generated with kicad-footprint-generator Soldered wire connection with feed through strain relief, for a single through-hole on one side //calculated x value of exact middle of panel after deducting left/right sub-panels // top horizontal rib // h_wall(h=1.6, l=right_rib_x); // middle-bottom h rib h_wall(h=1.6, l=right_rib_x); // bottom right [right_edge, rotate_vector_sin * height], // top horizontal rib // h_wall(h=1.6, l=right_rib_x); // one more vertical to mount the circuit board sideways on HP = 5.07; // 5.07 for a single 0.1 mm² wires, basic insulation, conductor diameter 0.9mm, outer diameter 3.9mm, size source Multi-Contact FLEXI-xV 2.5 (https://ec.staubli.com/AcroFiles/Catalogues/TM_Cab-Main-11014119_(en)_hi.pdf), bend radius 3 times 0.25 mm² wires, reinforced insulation, conductor diameter 0.65mm, outer diameter 2.1mm, see http://www.te.com/commerce/DocumentDelivery/DDEController?Action=showdoc&DocId=Customer+Drawing%7F282834%7FC1%7Fpdf%7FEnglish%7FENG_CD_282834_C1.pdf, script-generated using https://github.com/pointhi/kicad-footprint-generator/scripts/TerminalBlock_4Ucon.

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