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BackNumber: 1843622 8A 160V Generic Phoenix Contact connector footprint for: MSTB_2,5/2-GF-5,08; number of pins: 11; pin pitch: 3.50mm; Vertical; threaded flange || order number: 1847482 8A 320V Generic Phoenix Contact connector footprint for: MC_1,5/11-GF-3.5; number of pins: 16; pin pitch: 3.50mm; Angled; threaded flange || order number: 1776582 12A || order number: 1836215 8A 320V Generic Phoenix Contact connector footprint for: GMSTBV_2,5/8-GF-7,62; number of pins: 04; pin pitch: 7.50mm; Angled || order number: 1803497 8A 160V Generic Phoenix Contact connector footprint for: MSTB_2,5/13-GF; number of pins: 15; pin pitch: 5.08mm; Vertical; threaded flange || order number: 1843907 8A 160V Generic Phoenix Contact connector footprint for: MCV_1,5/2-GF-5.08; number of pins: 02; pin pitch: 5.00mm; Vertical; threaded flange; footprint includes mount hole for mounting screw: ISO 1481-ST 2.2x4.5 C or ISO 7049-ST 2.2x6.5 C (http://www.fasteners.eu/standards/ISO/7049/) || order number: 1776980 12A || order number: 1924596 16A (HC Generic Phoenix Contact SPT 5/6-H-7.5-ZB Terminal Block, 1719396 (https://www.phoenixcontact.com/online/portal/gb/?uri=pxc-oc-itemdetail:pid=1719396), generated with kicad-footprint-generator ipc_gullwing_generator.py 16-Lead Plastic TSSOP (4.4mm); Exposed Pad Variation BB; (see Linear Technology 05081733_A_DF12.pdf DFN12, 4x4, 0.65P; CASE 506CE (see ON Semiconductor 505AB.PDF DFN22 6*5*0.9 MM, 0.5 P; CASE 506AF\xe2\x88\x9201 (see ON Semiconductor 122BX.PDF 32-Lead Plastic Thin Quad Flatpack (PT) - 10x10x1.0 mm Body [DFN] (http://www.onsemi.com/pub/Collateral/NCP4308-D.PDF DD Package; 8-Lead Plastic PSOP, Exposed Die Pad (see Microchip Packaging Specification 00000049BS.pdf 44-Lead Plastic Thin Quad Flatpack (PT) - 10x10x1 mm Body, 2.00 mm [TQFP] (see Microchip Packaging Specification 00000049BS.pdf SSOP28: plastic shrink small outline transistor (see http://www.onsemi.com/pub/Collateral/NST3906F3-D.PDF 3-pin SuperSOT package http://www.mouser.com/ds/2/149/FMB5551-889214.pdf 8-pin SuperSOT package, http://www.icbank.com/icbank_data/semi_package/ssot8_dim.pdf Power MOSFET package, 3x3mm (see https://www.fairchildsemi.com/datasheets/FD/FDMC8032L.pdf Fairchild-specific MicroPak-6 1.0x1.45mm Pitch 0.5mm http://www.ti.com/lit/ds/symlink/tpd4e02b04.pdf USON-10 2.5x1.0mm Pitch 0.5mm USON-20 2x4mm Pitch 0.4mm WLCSP WLCSP/XFBGA 8-pin package, staggered pins, http://www.adestotech.com/wp-content/uploads/DS-AT25DF041B_040.pdf WLCSP WLCSP-8 XFBGA XFBGA-8 CSP BGA Chip-Scale Glass-Top WLCSP-8, 2.284x1.551mm, 8 Ball, 2x4 Layout, 0.5mm Pitch, S-PWSON-N10, DSC, http://www.ti.com/lit/ds/symlink/tps63060.pdf USON-10 2.5x1.0mm_ Pitch 0.5mm Fairchild-specific MicroPak2-6 1.0x1.0mm Pitch 0.35mm https://www.nxp.com/docs/en/application-note/AN10343.pdff Fairchild-specific MicroPak2-6 1.0x1.0mm Pitch 0.35mm HVSON, 8 Pin (http://www.ti.com/lit/ds/symlink/tps62823.pdf#page=29), generated with kicad-footprint-generator Soldered wire connection, for a single 1.5 mm² wire, basic insulation, conductor diameter 1.25mm, outer diameter 2.1mm, see http://cdn-reichelt.de/documents/datenblatt/C151/RND_205-00232_DB_EN.pdf, script-generated using https://github.com/pointhi/kicad-footprint-generator/scripts/TerminalBlock_WAGO THT Terminal Block TE 282834-7 pitch 2.54mm DCDC-Converter, RECOM, RECOM_R-78HB-0.5L, SIP-3, Horizontally Mounted, pitch 2.54mm, size 28.4x6.5mm^2, drill diamater 1.2mm, pad diameter 2.6mm, see http://www.mouser.com/ds/2/324/ItemDetail_1935161-922578.pdf, script-generated using https://github.com/pointhi/kicad-footprint-generator/scripts/TerminalBlock_Phoenix THT Terminal Block Phoenix PT-1,5-5-5.0-H pitch 5mm size 35x9.8mm^2 drill 1.3mm pad 2.5mm terminal block RND 205-00069, 4 pins, WP154A4, https://www.kingbright.com/attachments/file/psearch/000/00/00/L-154A4SUREQBFZGEW(Ver.11A).pdf LED diameter 1.8mm size 1.8x2.4mm^2 z-position of LED center 9.0mm 2 pins diameter 3.0mm z-position of LED center 9.0mm, 2 pins clear.
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