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Wuerth_HCI-7030, 6.9mmx6.9mm Inductor, Wuerth Elektronik, Wuerth_MAPI-4020, 4.0mmx4.0mm Inductor, Taiyo Yuden, MD series, Taiyo-Yuden_MD-5050, 5.0mmx5.0mm Inductor, Taiyo Yuden, NR series, Taiyo-Yuden_NR-60xx, 6.0mmx6.0mm Inductor, Taiyo Yuden, NR series, Taiyo-Yuden_NR-40xx, 4.0mmx4.0mm Inductor, Taiyo Yuden, NR series, Taiyo-Yuden_NR-40xx, 4.0mmx4.0mm Inductor, Wuerth Elektronik, Wuerth_HCM-1070, 10.1mmx7.0mm Inductor, Wuerth Elektronik, WE-DD, SMD, Typ LS, Handsoldering, https://katalog.we-online.com/pbs/datasheet/7447715906.pdf Shielded Power Inductor WE-PD TypM TypS Unshielded Inductor, Wuerth Elektronik, WE-PD, SMD, Typ L, Typ XL, https://katalog.we-online.com/pbs/datasheet/744776012.pdf Choke Power Inductor Fixed inductor SMD magnetically shielded Neosid, Inductor, PIC0512H, Power Inductor, Wuerth Elektronik, WE-PD, SMD, Typ L, , https://katalog.we-online.com/pbs/datasheet/74477510.pdf Choke Power Inductor WE-PDF Wuerth Handsoldering L_Wuerth_WE-TPC-3816 StepUp generated footprint, https://www.infineon.com/cms/en/product/packages/PG-LLGA/PG-LLGA-5-1/ AKM Current Sensor, 7 pin, THT (http://www.akm.com/akm/en/file/datasheet/CQ-236B.pdf akm current sensor smd AKM VSOP-24 current sensor, 6.5x8.1mm body, 0.95mm pitch (http://www.akm.com/akm/en/product/detail/0009/ Allegro MicroSystems, CB-PFF Package (http://www.allegromicro.com/en/Products/Current-Sensor-ICs/Fifty-To-Two-Hundred-Amp-Integrated-Conductor-Sensor-ICs/ACS758.aspx) !PADS 4-5 DO NOT MATCH DATASHEET! Allegro MicroSystems, CB-PFF Package (http://www.allegromicro.com/en/Products/Current-Sensor-ICs/Fifty-To-Two-Hundred-Amp-Integrated-Conductor-Sensor-ICs/ACS758.aspx) !PADS 4-5 DO NOT MATCH DATASHEET! Allegro MicroSystems, CB-PFF Package (http://www.allegromicro.com/en/Products/Current-Sensor-ICs/Fifty-To-Two-Hundred-Amp-Integrated-Conductor-Sensor-ICs/ACS758.aspx) !PADS 4-5 DO NOT MATCH DATASHEET! Allegro MicroSystems, CB-PSS Package (http://www.allegromicro.com/en/Products/Current-Sensor-ICs/Fifty-To-Two-Hundred-Amp-Integrated-Conductor-Sensor-ICs/ACS758.aspx Allegro MicroSystems, CB-PSS Package (http://www.allegromicro.com/en/Products/Current-Sensor-ICs/Fifty-To-Two-Hundred-Amp-Integrated-Conductor-Sensor-ICs/ACS758.aspx Allegro Microsystems SIP-3, 1.27mm Pitch (http://www.allegromicro.com/~/media/Files/Datasheets/A1363-Datasheet.ashx Diodes SIP-3 Bulk Pack, 1.27mm Pitch (http://www.allegromicro.com/~/media/Files/Datasheets/A1363-Datasheet.ashx Diodes SIP-3 Ammo Pack, 2.65mm Pitch (https://www.diodes.com/assets/Package-Files/SIP-3-Ammo-Pack.pdf Diodes SIP-3 Ammo Pack, 2.65mm Pitch (https://www.diodes.com/assets/Package-Files/SIP-3-Ammo-Pack.pdf Diodes SIP-3 Ammo Pack, 2.65mm Pitch (https://www.diodes.com/assets/Package-Files/SIP-3-Ammo-Pack.pdf Diodes SIP-3 Bulk Pack, 1.27mm Pitch (https://www.diodes.com/assets/Package-Files/SIP-3-Bulk-Pack.pdf Diodes SIP-3 Ammo Pack, 2.65mm Pitch (https://www.diodes.com/assets/Package-Files/SIP-3-Ammo-Pack.pdf Diodes SIP-3 Bulk Pack Diodes SIP-3 Bulk Pack, 1.27mm Pitch (http://www.allegromicro.com/~/media/Files/Datasheets/A1369-Datasheet.ashx Allegro Microsystems PSOF-7, 4.8x6.4mm Body, 1.60mm Pitch (http://www.allegromicro.com/~/media/Files/Datasheets/ACS780-Datasheet.ashx Allegro Microsystems 24-Lead Plastic DFN (3mm x 3mm); Pitch 0.4mm; EP 1.7x1.54mm; for InvenSense motion sensors; Mask removed below exposed pad; keepout area marked (Package see: https://store.invensense.com/datasheets/invensense/MPU9250REV1.0.pdf; See also https://www.invensense.com/wp-content/uploads/2015/02/InvenSense-MEMS-Handling.pdf 24-Lead Plastic QFN (2mm x 2mm) (see Linear Technology DFN_8_05-08-1702.pdf 8-Lead Plastic Dual Flat, No Lead Package (8E) - 4x4x0.9 mm Body [TQFP] With 4.5x4.5 mm Exposed Pad Variation BB; (see Linear Technology DFN_12_05-08-1695.pdf DF Package; 12-Lead Plastic Micro Small Outline Package (MS) [MSOP], variant of 8-lead though-hole mounted DIP package, row spacing 7.62 mm (300 mils), Socket 24-lead though-hole mounted DIP package, row spacing 15.24 mm (600 mils), Socket, LongPads 8-lead though-hole mounted DIP package, row spacing 7.62 mm (300 mils), SMDSocket, SmallPads 10-lead though-hole mounted DIP package, row spacing 7.62 mm (300 mils), Socket 64-lead though-hole mounted DIP package, row spacing 7.62 mm (300 mils 32-lead surface-mounted (SMD) DIP package, row spacing 7.62 mm (300 mils), http://multimedia.3m.com/mws/media/494546O/3mtm-dip-sockets-100-2-54-mm-ts0365.pdf 3M 20-pin zero insertion force socket, through-hole, row spacing 7.62 mm (300 mils), body size (see http://omronfs.omron.com/en_US/ecb/products/pdf/en-a6s.pdf SMD 4x-dip-switch SPST Omron_A6S-410x, Slide, row spacing 8.89 mm (350 mils), SMDSocket, LongPads 64-lead though-hole mounted DIP package, row spacing 25.4 mm (1000 mils), Socket, LongPads.

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