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ACP CA9-VSMD Potentiometer, vertical, Bourns 3339H, http://www.bourns.com/docs/Product-Datasheets/3339.pdf Potentiometer horizontal Bourns 3269P Potentiometer, vertical, ACP CA9-VSMD, http://www.acptechnologies.com/wp-content/uploads/2017/05/02-ACP-CA9-CE9.pdf Potentiometer horizontal Piher PC-16 Single, http://www.piher-nacesa.com/pdf/20-PC16v03.pdf Potentiometer vertical hole Piher PT-15-V15 Potentiometer, horizontal, Bourns 3006Y, https://www.bourns.com/docs/Product-Datasheets/3006.pdf Potentiometer horizontal Piher T-16H Single, http://www.piher-nacesa.com/pdf/22-T16v03.pdf Potentiometer vertical hole Piher PT-15-V02 Potentiometer, vertical, Piher PT-6-V, http://www.piher-nacesa.com/pdf/11-PT6v03.pdf Potentiometer vertical Vishay T73YP Abracon RHCP ceramic patch antenna 854-882Mhz, 5dBi Johanson 2450AT43F0100 SMD antenna 2400-2500Mhz, 3.7dBi, https://www.molex.com/content/dam/molex/molex-dot-com/products/automated/en-us/productspecificationpdf/479/47948/PS-47948-001-001.pdf?inline Johanson 0900FM15K0039 DFN, 10 Pin (https://www.johansontechnology.com/datasheets/0900FM15K0039/0900FM15K0039.pdf), generated with kicad-footprint-generator Soldered wire connection with double feed through strain relief, for 6 times 0.25 mm² wires, reinforced insulation, conductor diameter 0.9mm, outer diameter 3.9mm, size source Multi-Contact FLEXI-xV 0.75 (https://ec.staubli.com/AcroFiles/Catalogues/TM_Cab-Main-11014119_(en)_hi.pdf), bend radius 3 times 2.5 mm² wire, reinforced insulation, conductor diameter 2mm, outer diameter 3mm, see , script-generated with , script-generated with , script-generated with , script-generated with , script-generated using https://github.com/pointhi/kicad-footprint-generator/scripts/TerminalBlock_RND THT terminal block RND 205-00012, 2 pins, color: grey IR infrared LED with photo IC package for diode bridges, row spacing 22.86 mm (900 mils), Socket, LongPads 22-lead though-hole mounted DIP package, row spacing 8.89 mm (350 mils), SMDSocket, LongPads 20-lead though-hole mounted DIP package, row spacing 10.16 mm (400 mils 8-lead surface-mounted (SMD) DIP package, row spacing 7.62 mm (300 mils 32-lead surface-mounted (SMD) DIP package.

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