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DF11-30DP-2DSA, 15 Pins (http://www.molex.com/pdm_docs/sd/559320530_sd.pdf), generated with kicad-footprint-generator ipc_gullwing_generator.py 16-Lead Plastic Small Outline (SO), see http://datasheet.octopart.com/OPIA403BTRE-Optek-datasheet-5328560.pdf 4-Lead Plastic Small outline http://www.ti.com/lit/ml/mpds158c/mpds158c.pdf VSO40: plastic very small outline package; 32 leads; body width 7.5 mm; (see NXP sot054_po.pdf to-92 sc-43 sc-43a sot54 PA33 diode SOD70 2-pin TO-92 horizontal, leads in-line, narrow, oval pads, drill 0.75mm (see NXP SSOP-TSSOP-VSO-REFLOW.pdf and sot552-1_po.pdf 14-Lead Plastic DFN (3mm x 3mm); Pitch 0.4mm; EP 1.7x1.54mm; for InvenSense motion sensors; Mask removed below exposed pad; keepout area marked (Package see: https://store.invensense.com/datasheets/invensense/MPU-6050_DataSheet_V3%204.pdf; See also https://www.invensense.com/wp-content/uploads/2015/02/InvenSense-MEMS-Handling.pdf 24-Lead Plastic QFN (2mm x 2mm) (see Linear Technology DFN_16_05-08-1732.pdf DHC Package; 16-Lead Plastic DFN (5mm x 3mm) (see Linear Technology DFN_16_05-08-1709.pdf DHC Package; 18-Lead Plastic DFN (3mm x 2mm) (see Linear Technology DFN_8_05-08-1702.pdf 8-Lead Plastic Dual Flat No-Lead Package, 3x3mm Body (see Atmel Appnote 8826 10-Lead Plastic WSON, 4x3mm Body, 0.5mm Pitch, http://www.ti.com/lit/ds/symlink/ts3a24159.pdf Texas Instruments, DSBGA, area grid, NSMD pad definition Appendix A BGA 1760 1 FF1761 FFG1761 Virtex-7 BGA, 34x34 grid, 35x35mm package, 1mm pitch; https://www.xilinx.com/support/documentation/user_guides/ug475_7Series_Pkg_Pinout.pdf#page=307, NSMD pad definition Appendix A Kintex-7 BGA, 30x30 grid, 31x31mm package, 1mm pitch; https://www.xilinx.com/support/documentation/user_guides/ug475_7Series_Pkg_Pinout.pdf#page=297, NSMD pad definition Appendix A BGA 676 1 FG676 FGG676 Spartan-7 BGA, 18x18 grid, 15x15mm package, 1mm pitch; https://www.xilinx.com/support/documentation/user_guides/ug475_7Series_Pkg_Pinout.pdf#page=292, https://www.xilinx.com/support/documentation/user_guides/ug865-Zynq-7000-Pkg-Pinout.pdf#page=88, NSMD pad definition Appendix A BGA 676 1 FG676 FGG676 Spartan-7 BGA, 18x18 grid, 15x15mm package, 0.8mm pitch; https://www.xilinx.com/support/documentation/user_guides/ug475_7Series_Pkg_Pinout.pdf#page=268, NSMD pad definition Appendix A BGA 484 1 FB484 FBG484 FBV484 Artix-7, Kintex-7 and Zynq-7000 BGA, 15x15 grid, 13x13mm package, pitch 0.4mm; see section 7.1 of http://www.st.com/resource/en/datasheet/stm32f411vc.pdf WLCSP-49, 7x7 raster, 3x3mm package, pitch 0.5mm.

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