Labels Milestones
BackST die ID 460, 2.3x2.48mm, 25 Ball, 5x5 Layout, 0.4mm Pitch, https://pdfserv.maximintegrated.com/package_dwgs/21-100302.PDF, https://pdfserv.maximintegrated.com/package_dwgs/21-100302.PDF NXP VFBGA-42, 3.0x2.6mm, 42 Ball, 6x7 Layout, 0.4mm Pitch, https://www.st.com/resource/en/datasheet/stm32wb55vc.pdf Texas Instruments HSOP 9, 1.27mm pitch, double cols (from Kicad 4.0.7), script generated Through hole straight pin header, 2x11, 2.54mm pitch, 8.51mm socket length, single row style2 pin1 right Through hole pin header THT 1x05 2.54mm single row Surface mounted socket strip SMD 1x16 2.00mm single row style1 pin1 left Surface mounted pin header SMD 1x14 2.54mm single row style1 pin1 left Surface mounted pin header SMD 1x16 1.27mm single row Through hole angled pin header THT 2x21 1.27mm.