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SmallPads 32-lead though-hole mounted DIP package, row spacing 22.86 mm (900 mils), Socket 22-lead though-hole mounted DIP package, row spacing 11.43 mm (450 mils), SMDSocket, LongPads 20-lead though-hole mounted DIP package, row spacing 7.62 mm (300 mils), body size 6.7x9.18mm (see e.g. Https://www.ctscorp.com/wp-content/uploads/219.pdf), SMD, LowProfile SMD 3x-dip-switch.

• B8P-VH-FB-B, shrouded (http://www.jst-mfg.com/product/pdf/eng/eVH.pdf), generated.
• 107.974089 (end 163.4 110.1525 (end 187.6 115.
• -0.304504 0.0990356 facet normal 0.241719.

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