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2x36, 2.00mm pitch, 4.2mm pin length, double rows Surface mounted pin header SMD 1x13 1.27mm single row style1 pin1 left Surface mounted pin header SMD 2x12 2.54mm double row surface-mounted straight pin header, 2x17, 2.54mm pitch, DIN 41651 / IEC 60603-13, double rows, https://www.tme.eu/Document/4baa0e952ce73e37bc68cf730b541507/T821M114A1S100CEU-B.pdf SMD vertical IDC box header, 2x13, 2.54mm pitch, 8.51mm socket length, double cols (from Kicad 4.0.7), script generated Through hole angled pin header, 2x38, 2.54mm pitch, single row Through hole IDC header, 2x30, 2.54mm pitch, DIN 41651 / IEC 60603-13, double rows Surface mounted pin header SMD 1x21 2.00mm single row style2 pin1 right Through hole pin header THT 2x05 2.54mm double row Through hole angled pin header THT 2x07 2.54mm double row Through hole socket strip THT 1x23 1.27mm single row style1 pin1 left Surface mounted pin header SMD 2x05 2.00mm double row surface-mounted straight pin header, 1x29, 1.27mm pitch, 3.9x4.9mm body, exposed pad, DDA0008J (http://www.ti.com/lit/ds/symlink/tps5430.pdf 8-pin HTSOP package with missing pin 5, row spacing 7.62 mm (300 mils), Socket 18-lead though-hole mounted DIP package, row spacing 7.62 mm (300 mils 6-lead surface-mounted (SMD) DIP package, row spacing 7.62 mm (300 mils), SMDSocket, SmallPads 64-lead though-hole mounted DIP package, row spacing 7.62 mm (300 mils), SMDSocket, LongPads THT DIP DIL PDIP 2.54mm 7.62mm 300mil Socket 3M 28-pin zero insertion force socket, through-hole, row spacing 7.62 mm (300 mils), body size (see http://www.nidec-copal-electronics.com/e/catalog/switch/chs.pdf), SMD, JPin SMD 8x-dip-switch SPST CTS_Series194-8MSTN, Piano, row spacing 9.53 mm (375 mils), Clearance8mm 20-lead surface-mounted (SMD) DIP package, row spacing 10.16 mm (400 mils), LongPads 10-lead though-hole mounted DIP package, row spacing 15.24 mm (600 mils 48-lead surface-mounted (SMD) DIP package, row spacing 15.24 mm (600 mils THT DIP DIL PDIP 2.54mm 25.4mm 1000mil SMDSocket SmallPads 22-lead though-hole.

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