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Compressed files *.zip # Mac stuff *.DS_Store # Emacs temps *~ \#* # LTSpice Simulations/*.log Simulations/*.raw Simulations/*.txt Copper Layer Stackup: ============================================================= L1 : F.Cu front L2.

• [QFN]; (see Microchip Packaging Specification 00000049BS.pdf.
• Tented version (manually modified). For.
• Normal -0.115076 0.00068584 0.993356.

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