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IIPAK I2PAK TO-262-3, Vertical, RM 1.7mm, IIPAK, I2PAK, see http://www.onsemi.com/pub/Collateral/EN8586-D.PDF TO-262-3 Horizontal RM 0.97mm Multiwatt-9 staggered type-1 TO-220-7, Horizontal, RM 5.45mm, , see https://toshiba.semicon-storage.com/ap-en/design-support/package/detail.TO-3P(N).html TO-3P-3 Horizontal RM 5.08mm TO-220F-2, Vertical, RM 1.27mm, Multiwatt-7, staggered type-2 TO-220F-7, Vertical, RM 1.27mm, Multiwatt-7, staggered type-2 TO-220-11, Horizontal, RM 1.27mm, Multiwatt-7, staggered type-2 TO-220F-9 Vertical RM 2.54mm TO-220-4 Horizontal RM 5.45mm TO-247-4, Horizontal, RM 1.27mm, Multiwatt-7, staggered type-1 TO-220-4 Vertical RM 2.54mm TO-218-2, Horizontal, RM 5.45mm, see https://toshiba.semicon-storage.com/us/product/mosfet/to-247-4l.html TO-247-3 Horizontal RM 1.27mm Multiwatt-7 staggered type-2 TO-220-4, Vertical, RM 1.27mm, Multiwatt-7, staggered type-2 TO-220-7, Horizontal, RM 1.7mm, PentawattF-, MultiwattF-5, staggered type-2 TO-220F-5, Vertical, RM 2.54mm, see http://www.st.com/resource/en/datasheet/stp20nm60.pdf TO-220F-3 Horizontal RM 5.08mm TO-220F-3, Horizontal, RM 1.7mm, PentawattF-, MultiwattF-5, staggered type-1 TO-220-9 Horizontal RM 2.54mm staggered type-2 TO-220F-5 Vertical RM 2.54mm TO-218-2, Horizontal, RM 0.97mm, Multiwatt-9, staggered type-1 TO-220-11, Vertical, RM 2.54mm, see http://www.vishay.com/docs/88898/b2m.pdf DIL DIP PDIP 5.08mm 2.54 4-lead dip package with 1.27mm pin pitch, compatible with SOIC-8, 3.9x4.9mm body, exposed pad, 7x7mm body (http://www.analog.com/media/en/technical-documentation/data-sheets/AD7951.pdf, http://www.analog.com/en/design-center/packaging-quality-symbols-footprints/symbols-and-footprints/AD7951.html LFCSP-WD, 8 Pin (https://datasheet.lcsc.com/lcsc/2005251034_XTX-XTSD01GLGEAG_C558837.pdf#page=6), generated with kicad-footprint-generator Molex CLIK-Mate series connector, 505405-1370 (http://www.molex.com/pdm_docs/sd/5054050270_sd.pdf), generated with kicad-footprint-generator connector wire 0.15sqmm double-strain-relief Soldered wire connection, for 2 times 0.25 mm² wires, basic insulation, conductor diameter 1.4mm, outer diameter 3.9mm, size source Multi-Contact FLEXI-E 1.5 (https://ec.staubli.com/AcroFiles/Catalogues/TM_Cab-Main-11014119_(en)_hi.pdf), bend radius 3 times outer diameter, generated with kicad-footprint-generator ipc_gullwing_generator.py TSSOP, 48 Pin (http://www.st.com/resource/en/datasheet/stm32f042k6.pdf#page=94), generated with kicad-footprint-generator ipc_noLead_generator.py QFN, 24 Pin (JEDEC MO-153 Var AE https://www.jedec.org/document_search?search_api_views_fulltext=MO-153), generated with kicad-footprint-generator.

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