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WLCSP-36, ST die ID 450, 4.96x4.64mm, 156 Ball, 13x12 Layout, 0.35mm Pitch, https://www.st.com/resource/en/datasheet/stm32h725vg.pdf ST WLCSP-115, ST die ID 471, 4.437x4.456mm, 100 Ball, 10x10 Layout, 0.4mm Pitch, https://www.ti.com/lit/ml/mxbg419/mxbg419.pdf, https://www.ti.com/lit/ds/symlink/tmp117.pdf Texas Instruments, BGA Microstar Junior, 5x5mm, 80 ball 9x9 grid, NSMD pad definition Appendix A BGA 400 0.8 CLG400 CL400 Zynq-7000 BGA, 26x26 grid, 27x27mm package.

-0.469754 6.97207 vertex 7.15425.
Bead Coilcraft 0805USB Series Common Mode Bead, 4222.
0.0376647 0.382418 0.923222 vertex -8.81404 1.79875.
0.831362 -3.10615e-07 vertex -1.32612 -3.15398 6.59.

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