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0.4mm WLCSP WLCSP/XFBGA 8-pin package, staggered pins, http://www.adestotech.com/wp-content/uploads/DS-AT25DF041B_040.pdf WLCSP WLCSP-8 XFBGA XFBGA-8 CSP BGA Chip-Scale Glass-Top WLCSP-8, 2.284x1.551mm, 8 Ball, 2x4 Layout, 0.4mm.

• 23.32x6.5mm^2, drill diamater 1.3mm, pad diameter 2.5mm.
• [second_col, third_row, 0]; //Fourth row interface placement.
• Block WAGO 804-306, 45Degree (cable under 45degree.
• 2x11, 1.27mm pitch, single row style1.

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