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Raster, 4.095x5.094mm package, pitch 0.4mm; see section 7.4 of http://www.st.com/resource/en/datasheet/DM00366448.pdf WLCSP-168, 12x14 raster, 4.891x5.692mm package, pitch 0.4mm; see section 7.4 of http://www.st.com/resource/en/datasheet/DM00366448.pdf WLCSP-168, 12x14 raster, 4.891x5.692mm package, pitch 0.4mm; see section 7.5 of http://www.st.com/resource/en/datasheet/stm32f051t8.pdf UFBGA-100, 12x12 raster, 7x7mm package, pitch 0.5mm; see section 10.3 of https://www.parallax.com/sites/default/files/downloads/P8X32A-Propeller-Datasheet-v1.4.0_0.pdf QFN, 48 Pin (https://www.lumissil.com/assets/pdf/core/IS31FL3236_DS.pdf), generated with kicad-footprint-generator ipc_noLead_generator.py UQFN, 10 Pin (http://www.ti.com/lit/ds/symlink/ads1115.pdf), generated with kicad-footprint-generator Molex MicroClasp Wire-to-Board System, 55932-0330, 3 Pins per row (https://www.hirose.com/product/en/products/FH12/FH12-24S-0.5SH(55)/), generated with kicad-footprint-generator Molex CLIK-Mate series connector, BM02B-ACHSS-GAN-ETF (http://www.jst-mfg.com/product/pdf/eng/eACH.pdf), generated with kicad-footprint-generator ipc_noLead_generator.py 8-Lead Plastic Dual Flat, No Lead Package - 4.0x4.0x0.8 mm Body [UQFN]; (see Microchip Packaging Specification 00000049BS.pdf 80-Lead Plastic Thin Quad Flatpack (PT) - 7x7x1.0 mm Body, 2.00 mm [TQFP] (see Microchip Packaging Specification 00000049BS.pdf 80-Lead Plastic Thin Shrink Small Outline (SSO/Stretched SO), see https://www.vishay.com/docs/83831/lh1533ab.pdf SSO Stretched SO SOIC Pitch 2.54 SSO Stretched SO SOIC Pitch 1.27 SSOP-8 2.9 x2.8mm Pitch 0.65mm SSOP-8 2.95x2.8mm Pitch.

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