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ESOP-12B SMT Flat Package with Heatsink Tab, https://ac-dc.power.com/sites/default/files/product-docs/topswitch-jx_family_datasheet.pdf Power Integrations variant of 8-lead though-hole mounted DIP package, row spacing 7.62 mm (300 mils), Socket, LongPads 12-lead though-hole mounted DIP package, row spacing 22.86 mm (900 mils), LongPads 14-lead though-hole mounted DIP package, row spacing 15.24 mm (600 mils), SMDSocket, SmallPads 18-lead though-hole mounted DIP package, row spacing 8.89 mm (350 mils), SMDSocket, SmallPads 14-lead though-hole mounted DIP package, row spacing 15.24 mm (600 mils), LongPads 12-lead though-hole mounted DIP package, row spacing 9.53 mm (375 mils 22-lead surface-mounted (SMD) DIP package, row spacing 16.51 mm (650 mils), SMDSocket, LongPads 28-lead though-hole mounted DIP package, row spacing 7.62 mm (300 mils), https://toshiba.semicon-storage.com/info/docget.jsp?did=1421&prodName=TLP3021(S Toshiba 11-7A9 package, like 6-lead dip package for Everlight ITR8307/F43, see https://everlighteurope.com/index.php?controller=attachment&id_attachment=5385 package for diode bridges, row spacing 7.62 mm (300 mils), Socket 8-lead though-hole mounted DIP package, row spacing 25.4 mm (1000 mils 64-lead though-hole mounted DIP package, row spacing 10.16 mm (400 mils 10-lead though-hole mounted DIP package, row spacing 10.16 mm (400 mils 10-lead surface-mounted (SMD) DIP package, row spacing 7.62 mm (300 mils), LongPads THT DIP DIL ZIF 15.24mm 600mil.

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