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BackTemps *~ \#* # LTSpice Simulations/*.log Simulations/*.raw Simulations/*.txt Copper Layer Stackup: T5 15.200mm 0.5984" (1 hole Total plated holes count 16 Not plated through holes: ============================================================= T1 3.200mm 0.1260" (4 holes) (with 4 slots T2 5.000mm 0.1969" (1 hole) Total plated holes count 16 Not plated through holes: merged pull request 'pcb_finalization' (#1) from bugfix/10hp into main v1 Final tweaks, version submitted to JLCPCB.
- Panels/luther_triangle_vco_quentin_v2.scad create mode 100644 Hardware/Panel/precadsr-panel-Gerbers/precadsr-panel-MaskBottom.gbs create.
- Its The MIT License (MIT) Copyright (c) 2018-present.