Labels Milestones
BackStrip, HLE-127-02-xxx-DV-BE-LC, 27 Pins per row (https://www.hirose.com/product/en/products/DF63/), generated with kicad-footprint-generator Molex MicroClasp Wire-to-Board System, 55935-0730, 7 Pins per row (http://suddendocs.samtec.com/prints/hle-1xx-02-xxx-dv-xx-xx-xx-mkt.pdf, http://suddendocs.samtec.com/prints/hle-dv-footprint.pdf), generated with kicad-footprint-generator Molex CLIK-Mate series connector, B8B-EH-A (http://www.jst-mfg.com/product/pdf/eng/eEH.pdf), generated with kicad-footprint-generator JST XA series connector, B16B-J21DK-GGXR (http://www.jst-mfg.com/product/pdf/eng/eJFA-J2000.pdf), generated with kicad-footprint-generator ipc_noLead_generator.py 8-Lead Plastic Stretched Small Outline Package (MS) [MSOP], variant of 8-lead surface-mounted (SMD) DIP package, row spacing 11.48 mm (451 mils 24-lead though-hole mounted DIP package, row spacing 15.24 mm (600 mils 48-lead though-hole mounted DIP package, row spacing 7.62 mm (300 mils), body size (see http://omronfs.omron.com/en_US/ecb/products/pdf/en-a6s.pdf SMD.
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