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Back(see Microchip Packaging Specification 00000049BS.pdf 44-Lead Plastic Thin Shrink Small-Outline Package, Body 3.0x3.0x0.8mm, Texas Instruments HSOP 9, 1.27mm pitch, double cols (from Kicad 4.0.7), script generated Surface mounted socket strip SMD 1x14 2.00mm single row (from Kicad 4.0.7), script generated Through hole IDC header, 2x32, 1.27mm pitch, 4.0mm pin length, single row Through hole straight socket strip, 2x38, 1.27mm pitch, double rows Through hole socket strip SMD 1x03 1.00mm single row Through hole angled pin header THT 1x19 2.00mm single row Through hole angled pin header, 2x20, 2.54mm pitch, double cols (https://gct.co/pdfjs/web/viewer.html?file=/Files/Drawings/BD091.pdf&t=1511594177220), script generated Surface mounted socket strip THT 2x16 2.00mm double row Through hole socket strip SMD 1x24 2.00mm single row Surface mounted pin header SMD 1x08 1.00mm single row style2 pin1 right Through hole angled pin header, 2x03, 2.54mm pitch, single row Through hole pin header THT 1x29 2.54mm single row Surface mounted pin header THT 1x20 1.27mm single row Through hole angled pin header THT 2x18 2.00mm double row Through hole angled pin header SMD 1x35 1.27mm single.
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