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FHG1761 Virtex-7 BGA, 42x42 grid, 42.5x42.5mm package, 1mm pitch; https://www.xilinx.com/support/documentation/user_guides/ug475_7Series_Pkg_Pinout.pdf#page=306, NSMD pad definition Appendix A BGA 1760 1 FF1761 FFG1761 Virtex-7 BGA, 42x42 grid, 42.5x42.5mm package, 1mm pitch; https://www.xilinx.com/support/documentation/user_guides/ug475_7Series_Pkg_Pinout.pdf#page=305, NSMD pad definition (http://www.ti.com/lit/ds/symlink/bq51050b.pdf, http://www.ti.com/lit/an/snva009ag/snva009ag.pdf Texas Instruments HSOP 9, 1.27mm pitch, double cols (from Kicad 4.0.7), script generated Surface mounted socket strip THT 1x10 1.27mm single row Through hole angled socket strip, 1x01, 2.54mm pitch, 8.51mm socket length, single row Through hole socket strip THT 1x25 1.00mm single row Surface mounted socket strip THT 1x38 1.27mm single row Through hole pin header THT 2x36 2.54mm double row Through hole angled pin header, 2x30, 1.00mm pitch, single row style2 pin1 right Through hole socket strip THT 2x05 2.54mm double row Through hole angled pin header SMD 1x38 1.27mm single row.

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