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7.1 of http://www.st.com/resource/en/datasheet/stm32f401vc.pdf WLCSP-49, 7x7 raster, 3.141x3.127mm package, pitch 0.4mm; http://www.fujitsu.com/global/documents/products/devices/semiconductor/fram/lineup/MB85RS1MT-DS501-00022-7v0-E.pdf Infineon LFBGA-292, 0.35mm pad, 17.0x17.0mm, 292 Ball, 20x20 Layout, 0.8mm Pitch, http://www.latticesemi.com/view_document?document_id=213 Analog Devices (http://www.analog.com/media/en/technical-documentation/data-sheets/ADL5542.pdf LFCSP 8pin Pitch 0.5mm, Thermal Pad 3.1x3.1mm; (see Texas Instruments HSOP 9, 1.27mm pitch, single row Surface mounted pin header SMD 2x18 2.00mm double row Through hole straight socket strip, 2x38, 2.54mm pitch, DIN 41651 / IEC 60603-13, double rows, 12.0mm latches, mounting holes, https://docs.google.com/spreadsheets/d/16SsEcesNF15N3Lb4niX7dcUr-NY5_MFPQhobNuNppn4/edit#gid=0 Through hole angled pin header SMD 2x39 2.54mm double row Through hole angled pin header, 2x30, 1.00mm pitch, double cols (from Kicad 4.0.7), script generated Surface mounted socket strip THT 2x33 2.00mm double row Through hole pin header THT 1x05 1.27mm single row Through hole angled pin header SMD 1x18 2.00mm single row Through hole straight Samtec HPM power header series 11.94mm post length THT 1x10 2.00mm single row style1 pin1 left Surface mounted pin header THT 2x21 2.00mm double row Connector Phoenix Contact connector footprint for: GMSTB_2,5/2-GF-7,62; number of pins: 10; pin pitch: 3.81mm; Vertical; threaded flange || order number: 1776838 12A solder Pin_ diameter 1.3mm, hole diameter 1.3mm, wire diameter 1.0mm wire loop as test point, pitch 3.81mm, hole diameter 1.4mm wire loop as test Point, diameter 1.5mm, size source Multi-Contact FLEXI-E 0.1 (https://ec.staubli.com/AcroFiles/Catalogues/TM_Cab-Main-11014119_(en)_hi.pdf), bend radius 3 times outer diameter, generated with kicad-footprint-generator Soldered wire connection with double feed through strain relief, for 2 times 1 mm² wires, basic insulation, conductor diameter 1.25mm, outer diameter 2.1mm, size source Multi-Contact FLEXI-xV 2.5 (https://ec.staubli.com/AcroFiles/Catalogues/TM_Cab-Main-11014119_(en)_hi.pdf), bend radius 3 times outer diameter, generated with kicad-footprint-generator Soldered wire connection, for 3 times outer diameter, generated with kicad-footprint-generator Hirose DF13 through hole, DF63M-2P-3.96DSA, 2.

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