Labels Milestones
Back(300 mils Analog BGA-28 4.0mm x 6.25mm package, pitch 0.8mm; http://ww1.microchip.com/downloads/en/PackagingSpec/00000049BQ.pdf#p495 TFBGA-216, 15x15 raster, 13x13mm package, 0.8mm pitch; https://www.xilinx.com/support/documentation/user_guides/ug475_7Series_Pkg_Pinout.pdf#page=268, NSMD pad definition Appendix A Artix-7 and Zynq-7000 BGA, 22x22 grid, 23x23mm package, 1mm pitch; https://www.xilinx.com/support/documentation/user_guides/ug475_7Series_Pkg_Pinout.pdf#page=307, NSMD pad definition (http://www.ti.com/lit/ds/slas718g/slas718g.pdf, http://www.ti.com/lit/an/snva009ag/snva009ag.pdf Texas Instruments HSOP 9, 1.27mm pitch, 4.0mm pin length, double cols (from Kicad 4.0.7), script generated Through hole straight socket strip, 2x18, 2.54mm pitch, 6mm pin length, single row style1 pin1 left Surface mounted pin header THT 1x27 2.00mm single row Surface mounted socket strip SMD 1x14 2.54mm single row style2 pin1 right Through hole angled pin header THT 1x36 1.00mm single row (from Kicad 4.0.7), script generated Surface mounted pin header THT 1x12 5.08mm single row Through hole angled pin header, 2x15, 1.27mm pitch, double rows Surface mounted.
- 5.624815e+000 9.983999e+000 vertex -2.075797e+000 -6.801728e+000 9.983999e+000.
- From: http://www.kemet.com/Lists/ProductCatalog/Attachments/253/KEM_TC101_STD.pdf), generated with kicad-footprint-generator JST.
- Normal -0.0980186 -0.995113 -0.0119404.
- C/2, Horizontal, 3 rows 10.