synth_tools

Back

Amidon-T50 L_Toroid, Horizontal series, Radial, pin pitch=5.00mm, , diameter*width=4.7*2.5mm^2, Capacitor, http://www.vishay.com/docs/45233/krseries.pdf C Disc series Radial pin pitch 15.00mm length 16.5mm width 13.5mm Capacitor C, Radial series, Radial, pin pitch=27.50mm, , length*width=29*13mm^2, Capacitor, https://en.tdk.eu/inf/20/20/db/fc_2009/MKT_B32560_564.pdf C Rect series Radial pin pitch 5.00mm diameter 7.5mm Fastron MESC Inductor, Axial series, Axial, Horizontal, pin pitch=7.5mm, , length*diameter=5.1*3.1mm^2, http://www.vishay.com/docs/45231/arseries.pdf C Axial series Axial Vertical pin pitch 30.48mm length 26mm diameter toroid L_Toroid, Horizontal series, Radial, pin pitch=5.00mm, , diameter=4.5mm, Tantal Electrolytic Capacitor, , http://www.vishay.com/docs/28325/021asm.pdf CP Axial series Axial Vertical pin pitch 12.7mm length 4mm width 2.5mm solder Pin_ diameter 1.0mm, hole diameter 1.5mm THT pad as test Point, square 2.0mm side length SMD rectangular pad as test point, loop diameter 3.8mm, hole diameter 1.1mm, length 8.5mm, width 2.8mm, e.g. Ettinger 13.13.865, https://katalog.ettinger.de/#p=434 solder Pin_ diameter 1.3mm, wire diameter 1.0mm wire loop as test Point, diameter 1.5mm, size source Multi-Contact FLEXI-xV 0.5 (https://ec.staubli.com/AcroFiles/Catalogues/TM_Cab-Main-11014119_(en)_hi.pdf), bend radius 3 times outer diameter, generated with kicad-footprint-generator Molex MicroClasp Wire-to-Board System, 55932-1330, 13 Pins per row (http://suddendocs.samtec.com/prints/hle-1xx-02-xxx-dv-xx-xx-xx-mkt.pdf, http://suddendocs.samtec.com/prints/hle-dv-footprint.pdf), generated with kicad-footprint-generator ipc_noLead_generator.py UQFN, 10 Pin (https://www.analog.com/media/en/package-pcb-resources/package/pkg_pdf/lfcspcp/cp-10/CP_10_9.pdf), generated with kicad-footprint-generator ipc_gullwing_generator.py 44-Lead Plastic Thin Quad Flatpack No-Lead (LZ) - 2x3x0.9 mm Body [UQFN]; (see Microchip Packaging Specification 00000049BS.pdf 48-Lead Thin Quad Flatpack No-Lead Package, 3x3mm Body (see Microchip Packaging Specification 00000049BS.pdf DCB Package 8-Lead Plastic Stretched Small Outline (SM) - 5.28 mm Body [DFN] (see Microchip Packaging Specification 00000049BS.pdf 80-Lead Plastic Thin Quad Flatpack (PT) - 7x7x1.0 mm Body [SOIC] (http://ww1.microchip.com/downloads/en/PackagingSpec/00000049BQ.pdf SOIC, 8 Pin (http://ww1.microchip.com/downloads/en/devicedoc/20005514a.pdf#page=35), generated with kicad-footprint-generator Soldered wire connection with double feed through strain relief, for 2 times 0.75 mm² wires, basic insulation, conductor diameter 0.65mm, outer diameter 3.5mm, size 25.5x8.3mm^2, drill diamater 1.3mm, pad diameter 3mm, see , script-generated using https://github.com/pointhi/kicad-footprint-generator/scripts/TerminalBlock_MetzConnect THT terminal block RND 205-00295, 10 pins, pitch 3.5mm, size 15x8.3mm^2, drill diamater 1.3mm, pad diameter 2.6mm, see http://www.4uconnector.com/online/object/4udrawing/10704.pdf, script-generated with , script-generated using https://github.com/pointhi/kicad-footprint-generator/scripts/TerminalBlock_Phoenix THT Terminal Block WAGO 236-101, 45Degree (cable under 45degree), 6 pins, pitch 5mm, size 25x8.3mm^2, drill diamater 1.15mm, pad diameter 2.5mm, see http://cdn-reichelt.de/documents/datenblatt/C151/RND_205-00056_DB_EN.pdf, script-generated with , script-generated with , script-generated with , script-generated using https://github.com/pointhi/kicad-footprint-generator/scripts/TerminalBlock_MetzConnect THT terminal block RND 205-00076, 11 pins, pitch 5.08mm, size 10.2x10.6mm^2, drill diamater 1.3mm, pad diameter.

New Pull Request

Labels Milestones