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BGA-81 Altera BGA-100 M100 MBGA 121-ball, 0.8mm BGA (based on http://www.latticesemi.com/view_document?document_id=213 BGA 0.8mm 9mm 121 BGA-132 11x17 12x18mm 1.0pitch Altera BGA-144 M144 MBGA Altera VBGA V81 BGA-81 Altera BGA-100 M100 MBGA 121-ball, 0.8mm BGA (based on standard DIP-4), row spacing 7.62 mm (300 mils), body size (see http://www.kingtek.net.cn/pic/201601201417455112.pdf SMD 9x-dip-switch SPST , Slide, row spacing 15.24 mm (600 mils 48-lead though-hole mounted DIP package, row spacing 7.62 mm (300 mils), SMDSocket, SmallPads 28-lead though-hole mounted DIP package, row spacing 7.62 mm (300 mils 18-lead though-hole mounted DIP package, row spacing 15.24 mm (600 mils), SMDSocket, LongPads 12-lead though-hole mounted DIP package, row spacing 15.24 mm (600 mils), LongPads THT DIP DIL ZIF 10.16mm 400mil 4-lead though-hole mounted DIP package, row spacing 9.53 mm (375 mils 18-lead surface-mounted (SMD) DIP package, row spacing 7.62 mm (300 mils), body size (see https://www.ctscorp.com/wp-content/uploads/194-195.pdf 2x-dip-switch SPST KingTek_DSHP02TJ, Slide, row spacing 7.62 mm (300 mils), Socket, LongPads 40-lead though-hole mounted DIP package, row spacing 7.62 mm (300 mils 4-lead surface-mounted (SMD) DIP package, row spacing 7.62 mm (300 mils), body size (see http://www.nidec-copal-electronics.com/e/catalog/switch/chs.pdf), SMD, JPin SMD 6x-dip-switch SPST , Slide, row spacing 7.62 mm (300 mils), SMDSocket, SmallPads THT DIP DIL PDIP 2.54mm 25.4mm 1000mil 40-lead though-hole mounted DIP package, row spacing 25.4 mm (1000 mils), Socket THT DIP DIL PDIP 2.54mm 7.62mm 300mil 8-lead dip package, row spacing 7.62 mm (300 mils), body size (see http://omronfs.omron.com/en_US/ecb/products/pdf/en-a6s.pdf SMD 6x-dip-switch SPST KingTek_DSHP06TJ, Slide, row spacing 7.62 mm (300 mils), LongPads 5-lead though-hole mounted DIP package, row spacing 9.53 mm (375 mils 16-lead though-hole mounted DIP package, row spacing 9.53 mm (375 mils), Clearance8mm 16-lead surface-mounted (SMD) DIP package, row spacing 8.9 mm (350 mils), SMDSocket, SmallPads 18-lead though-hole mounted DIP package, row spacing 7.62 mm (300 mils), LongPads, see https://ac-dc.power.com/sites/default/files/product-docs/tinyswitch-iii_family_datasheet.pdf Power Integrations K Package PowerPAK SO-8 Single (https://www.vishay.com/docs/71655/powerpak.pdf, https://www.vishay.com/docs/72599/72599.pdf 16-Lead Plastic Small Outline (ST)-4.4 mm Body [DFN] (see Microchip Packaging Specification 00000049BS.pdf 20-Lead Plastic Quad Flat, No Lead Package (8MA2) - 2x3x0.6 mm Body [QFN]; (see Microchip Packaging Specification 00000049BS.pdf DFN, 10 Pin (http://www.ti.com/lit/ml/mpds579b/mpds579b.pdf), generated with kicad-footprint-generator Molex SPOX Connector System, 43045-0821 (alternative finishes: 43045-160x), 8 Pins (http://www.farnell.com/datasheets/2157639.pdf), generated with kicad-footprint-generator Mounting Hardware, inside through hole 2.7mm, height 7, Wuerth electronics 9774020982 (https://katalog.we-online.de/em/datasheet/9774020982.pdf), generated with kicad-footprint-generator Soldered wire connection with double feed through strain relief, for 6 times 1 mm² wire, reinforced insulation, conductor diameter 1.7mm, outer diameter 3mm, see , script-generated using https://github.com/pointhi/kicad-footprint-generator/scripts/TerminalBlock_MetzConnect THT single screw terminal block RND 205-00021, 11 pins, pitch 5.08mm, size 71.1x9.8mm^2, drill diamater 1.4mm, pad diameter 2.6mm.

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