Labels Milestones
BackPackage; 6-Lead Plastic DFN (3mm x 2mm) (see Linear Technology DFN_18_05-08-1778.pdf DFN20, 6x5, 0.5P; CASE 506CN (see ON Semiconductor 506BU.PDF 8-Lead Plastic Dual Flat No-Lead Package, Body 4.4x6.5x1.1mm, Pad 3.0x4.2mm, Texas Instruments HSOP 9, 1.27mm pitch, 4.0mm pin length, single row (from Kicad 4.0.7), script generated Through hole IDC header, 2x07, 2.54mm pitch, 8.51mm socket length, single row Surface mounted pin header SMD 1x36 1.00mm single row style2 pin1 right Through hole straight pin header, 2x12, 2.54mm pitch, double rows Surface mounted pin header THT 1x35 2.54mm single row Surface mounted pin header SMD 1x18 1.00mm single row (from Kicad 4.0.7), script generated Through hole angled pin header SMD 1x04 2.00mm single row Surface mounted pin header SMD 2x06 1.27mm double row Through hole IDC header, 2x20, 2.54mm pitch, DIN 41651 / IEC 60603-13, double rows Through hole angled pin header, 2x39, 2.54mm pitch, DIN 41651 / IEC 60603-13, double rows, 9.5mm latches, https://docs.google.com/spreadsheets/d/16SsEcesNF15N3Lb4niX7dcUr-NY5_MFPQhobNuNppn4/edit#gid=0 Through hole angled socket strip THT 1x33 2.00mm single row style1 pin1 left Surface mounted pin header SMD 1x07 1.27mm single row Through hole straight Samtec HPM power header series 11.94mm post length, 1x18, 5.08mm pitch, single row Through hole straight pin header, 1x07, 2.54mm pitch, 6mm pin length, single row Surface mounted socket strip SMD 1x21 1.27mm single row.
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