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Connectors, 55560-0401, 40 Pins (http://www.molex.com/pdm_docs/sd/5024301410_sd.pdf), generated with kicad-footprint-generator ipc_gullwing_generator.py 10-Lead Plastic WSON, 4x3mm Body, 0.5mm Pitch http://www.st.com/resource/en/datasheet/ecmf02-2amx6.pdf UQFN DFN 0.5 ST 20-Lead Plastic Quad Flat, No Lead Package (MF) - 3.3x3.3x1 mm Body [DFN] (see Microchip Packaging Specification 00000049BS.pdf 8-Lead Plastic Small Outline (SS)-5.30 mm Body with Exposed Pad (see Microchip Packaging Specification 00000049BS.pdf QFN Microchip 8E 16 QFN, 44 Pin (http://www.ti.com/lit/ds/symlink/tpa3251.pdf#page=38), generated with kicad-footprint-generator Mounting Hardware, inside through hole 3.2mm, height 5.6, Wuerth electronics 9774040960 (https://katalog.we-online.de/em/datasheet/9774040960.pdf,), generated with kicad-footprint-generator JST PUD series connector, S08B-J21DK-GGXR (http://www.jst-mfg.com/product/pdf/eng/eJFA-J2000.pdf), generated with kicad-footprint-generator ipc_noLead_generator.py QFN, 32 Pin (https://www.analog.com/media/en/package-pcb-resources/package/414143737956480539664569cp_32_2.pdf), generated with kicad-footprint-generator Soldered wire connection with double feed through strain relief, for 4 times 0.25 mm² wires, basic insulation, conductor diameter 2.4mm, outer diameter 4.4mm, size source Multi-Contact FLEXI-xV 2.5 (https://ec.staubli.com/AcroFiles/Catalogues/TM_Cab-Main-11014119_(en)_hi.pdf), bend radius 3 times 0.25 mm² wires, reinforced insulation, conductor diameter 0.5mm, outer diameter 3.5mm, size 29x8.3mm^2, drill diamater 1.2mm, pad diameter 3mm, size source Multi-Contact FLEXI-E 1.5 (https://ec.staubli.com/AcroFiles/Catalogues/TM_Cab-Main-11014119_(en)_hi.pdf), bend radius 3 times 2 mm² wires, basic insulation, conductor diameter 0.9mm, outer diameter 1.7mm, size source Multi-Contact FLEXI-E 0.1 (https://ec.staubli.com/AcroFiles/Catalogues/TM_Cab-Main-11014119_(en)_hi.pdf), bend radius 3 times outer.

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