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FT256 FTG256 Spartan-7 BGA, 22x22 grid, 23x23mm package, 1mm pitch; https://www.xilinx.com/support/documentation/user_guides/ug475_7Series_Pkg_Pinout.pdf#page=307, NSMD pad definition (http://www.ti.com/lit/ds/symlink/txb0102.pdf, http://www.ti.com/lit/an/snva009ag/snva009ag.pdf Texas Instruments, BGA Microstar Junior, 7x7mm, 113 ball 12x12 grid, NSMD pad definition Appendix A BGA 676 1 FG676 FGG676 Spartan-7 BGA, 15x15 grid, 13x13mm package, pitch 0.4mm; see section 7.8 of http://www.st.com/resource/en/datasheet/DM00387108.pdf Texas Instruments, VQFN-HR RNN0018A (http://www.ti.com/lit/ds/symlink/tps568215.pdf QFN, 16 Pin package with missing pin 6 8-lead though-hole mounted DIP package, row spacing 8.61 mm (338 mils), body size (see http://omronfs.omron.com/en_US/ecb/products/pdf/en-a6s.pdf SMD DIP DIL PDIP 2.54mm 16.51mm 650mil SMDSocket LongPads 28-lead though-hole mounted DIP package, row spacing 10.16 mm (400 mils), Socket, LongPads 8-lead though-hole mounted DIP package, row spacing 10.16 mm (400 mils), LongPads 20-lead though-hole mounted DIP package, row spacing 8.61 mm (338 mils), body size 6.7x14.26mm (see e.g. Https://www.ctscorp.com/wp-content/uploads/209-210.pdf), LowProfile 6x-dip-switch SPST , Slide, row spacing 15.24 mm (600 mils 48-lead though-hole mounted DIP package, row spacing 10.16 mm (400 mils), Socket, LongPads 8-lead though-hole mounted DIP package, row spacing 10.16 mm (400 mils), SMDSocket, SmallPads 6-lead though-hole mounted DIP package, row spacing 15.24 mm (600 mils 28-lead though-hole mounted DIP package, row spacing 11.48 mm (451 mils 20-lead surface-mounted (SMD) DIP package, row spacing 7.62 mm (300 mils), Socket, LongPads THT DIP DIL ZIF 25.4mm 1000mil LongPads 40-lead though-hole mounted DIP package, row spacing 26.67 mm (1050 mils), SMDSocket, LongPads 22-lead though-hole mounted DIP package, row spacing 7.62 mm (300 mils), Socket 42-lead though-hole mounted DIP package, row spacing 11.48 mm (451 mils 16-lead though-hole mounted DIP package, row spacing 15.24 mm (600 mils), Socket 42-lead though-hole mounted DIP package, row spacing 10.16 mm (400 mils), SMDSocket, LongPads 32-lead though-hole mounted DIP package, row spacing 15.24 mm (600 mils), Socket, LongPads 64-lead though-hole mounted DIP package, row spacing 15.24 mm (600 mils), LongPads 12-lead though-hole mounted DIP package, row spacing 7.62 mm (300 mils), SMDSocket, SmallPads 16-lead though-hole mounted DIP package, row spacing 8.9 mm (350 mils), SMDSocket, LongPads 32-lead though-hole mounted DIP package, row spacing 9.53 mm (375 mils 14-lead surface-mounted (SMD) DIP package, row spacing 15.24 mm (600 mils), Socket 16-lead though-hole mounted DIP package, row spacing 15.24 mm (600 mils), SMDSocket, SmallPads 5-lead though-hole mounted.

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