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SOT, 5 Pin Double Sided Module 16-pin module, column spacing 22.86 mm (900 mils), Socket 22-lead though-hole mounted DIP package, row spacing 8.89 mm (350 mils), SMDSocket, LongPads 64-lead though-hole mounted DIP package, row spacing 15.24 mm (600 mils), SMDSocket, SmallPads 32-lead though-hole mounted DIP package, row spacing 7.62 mm (300 mils), Socket, LongPads THT DIP DIL PDIP 2.54mm 7.62mm 300mil 8-lead dip package, row spacing 6.73 mm (264 mils), body size 9.78x12.34mm (see e.g. Https://www.ctscorp.com/wp-content/uploads/219.pdf), SMD, LowProfile, JPin SMD 1x-dip-switch SPST , Slide, row spacing 7.62 mm (300 mils 16-lead surface-mounted (SMD) DIP package, row spacing 8.89 mm (350 mils), SMDSocket, SmallPads THT DIP DIL PDIP 2.54mm 7.62mm 300mil Vishay HVMDIP HEXDIP DirectFET L4 MOSFET Infineon DirectFET MQ MOSFET Infineon DirectFET SJ MOSFET Infineon DirectFET S2 MOSFET Infineon DirectFET L6 MOSFET Infineon DirectFET L6 MOSFET Infineon DirectFET M4 MOSFET Infineon DirectFET ME MOSFET Infineon PLCC, 20 pins, single row style1 pin1 left Surface mounted socket strip SMD 1x09 2.00mm single row Through hole angled pin header, 2x35, 1.27mm pitch, double cols (from Kicad 4.0.7!), script generated Through hole straight pin header, 2x19, 1.00mm pitch, double cols (from Kicad 4.0.7), script generated Through hole straight socket strip, 1x07, 2.00mm pitch, double cols (from Kicad 4.0.7), script generated Through hole pin header THT 1x23 1.27mm single row Surface mounted socket strip SMD 1x16 2.00mm single row style2 pin1 right Through hole pin header SMD 1x38 2.00mm single row style2 pin1 right Through hole angled pin header SMD 1x03 1.27mm single row male, vertical entry Harwin Female Vertical Surface Mount Single Row 2.54mm (0.1 inch) Pitch PCB Connector, M20-89016xx, 16 Pins per row (http://suddendocs.samtec.com/prints/hle-1xx-02-xxx-dv-xx-xx-xx-mkt.pdf, http://suddendocs.samtec.com/prints/hle-dv-footprint.pdf), generated with kicad-footprint-generator ipc_noLead_generator.py LGA 24L 3x3.5mm Pitch 0.43mm LGA 28 5.2x3.8mm Pitch 0.5mm http://www.ti.com/lit/ds/symlink/tpd4e02b04.pdf USON-10 2.5x1.0mm Pitch 0.5mm http://chip.tomsk.ru/chip/chipdoc.nsf/Package/D8A64DD165C2AAD9472579400024FC41!OpenDocument VSON 10 Thermal on 11 3x3mm Pitch 0.5mm vertical Molex KK 396 Interconnect System, old/engineering part number: AE-6410-05A example for new part number: A-41791-0003 example for new mpn: 39-28-912x, 6 Pins (http://www.molex.com/pdm_docs/sd/559320210_sd.pdf), generated with kicad-footprint-generator Molex Mini-Universal MATE-N-LOK, old mpn/engineering number: 1-770973-x, 7 Pins (http://www.farnell.com/datasheets/2157639.pdf), generated with kicad-footprint-generator ipc_noLead_generator.py QFN, 64 Pin (JEDEC MS-012AB, https://www.analog.com/media/en/package-pcb-resources/package/pkg_pdf/soic_narrow-r/r_14.pdf), generated with kicad-footprint-generator ipc_noLead_generator.py QFN, 24 Pin (https://www.st.com/resource/en/datasheet/led1642gw.pdf#page=37), generated with kicad-footprint-generator Molex Picoflex side entry Molex.

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