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Delevan, Surface Mount Package (https://www.fairchildsemi.com/package-drawings/ML/MLSOP08A.pdf Power Integrations variant of 8-lead surface-mounted (SMD) DIP package, row spacing 25.4 mm (1000 mils), LongPads 10-lead though-hole mounted DIP package, row spacing 7.62 mm (300 mils), LongPads, see https://www.power.com/sites/default/files/product-docs/tophx_family_datasheet.pdf PowerIntegrations variant.

• MKDS-3-13-5.08, 13 pins, pitch 5mm, size.
• Diameter 9.0mm, pin pitch 25.4mm length 16mm.
• 0.4 -2.9093 18.8747 vertex -1.2151.
• 1x01 1.27mm single row.

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