Labels Milestones
BackWLCSP-100, ST die ID 464, 2.58x3.07mm, 36 Ball, 6x6 Layout, 0.4mm Pitch, http://www.st.com/content/ccc/resource/technical/document/technical_note/92/30/3c/a1/4c/bb/43/6f/DM00103228.pdf/files/DM00103228.pdf/jcr:content/translations/en.DM00103228.pdf pSemi CSP-16 1.64x2.04x0.285mm (http://www.psemi.com/pdf/datasheets/pe29101ds.pdf, http://www.psemi.com/pdf/app_notes/an77.pdf UFD Package, 4-Lead Plastic Small Outline Narrow Body Body [QSOP] (http://www.allegromicro.com/~/media/Files/Datasheets/ACS726-Datasheet.ashx?la=en Allegro Microsystems 24-Lead Plastic Shrink Small Outline (SO) - Wide, 5.3 mm Body [SOIC], pin 7 8-lead though-hole mounted DIP package, row spacing 7.62 mm.
- -3.476637e-003 6.247023e-001 vertex 4.089033e+000.
- 8.52891e-07 -0.995037 vertex 9.91705 -1.25281 0.0413265.