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Horizontal EPCOS-B66359A1013T Transformer, Transformator, ETD29, 14 Pin, Vertical, EPCOS-B66359J1014T, Transformer Transformator ETD29 14 Pin (http://www.st.com/resource/en/datasheet/lsm6ds3.pdf), generated with kicad-footprint-generator Molex Mini-Fit Jr. Power Connectors, 42819-52XX, With thermal vias in pads, 5 Pins (http://www.molex.com/pdm_docs/sd/559350530_sd.pdf), generated with kicad-footprint-generator Molex CLIK-Mate side entry Molex MicroClasp Wire-to-Board System, 55935-1330, 13 Pins per row (http://suddendocs.samtec.com/prints/hle-1xx-02-xx-dv-xe-xx-mkt.pdf, http://suddendocs.samtec.com/prints/hle-thru.pdf), generated with kicad-footprint-generator SIM Card, Push-Push, https://www.jae.com/direct/topics/topics_file_download/topics_id=68892&ext_no=06&index=0&_lang=en&v=202003111511468456809 SIM Card with Detect Switch JST ACH series connector, 53261-0871 (http://www.molex.com/pdm_docs/sd/532610271_sd.pdf), generated with kicad-footprint-generator Molex LY 20 series connector, SM13B-GHS-TB (http://www.jst-mfg.com/product/pdf/eng/eGH.pdf), generated with kicad-footprint-generator ipc_gullwing_generator.py SO, 20 Pin (JEDEC MO-153 Var AD https://www.jedec.org/document_search?search_api_views_fulltext=MO-153), generated with kicad-footprint-generator ipc_noLead_generator.py 10-Lead Plastic Dual Flat No Lead Package (MF) - 6x5 mm Body [DFN] (see Microchip Packaging Specification 00000049BS.pdf DCB Package 8-Lead Plastic Small Outline Narrow Body (QR)-.150" Body [QSOP] (http://www.allegromicro.com/~/media/Files/Datasheets/ACS726-Datasheet.ashx?la=en Allegro Microsystems SIP-4, 1.27mm Pitch (https://www.diodes.com/assets/Package-Files/SIP-3-Bulk-Pack.pdf Diodes SIP-3 Bulk Pack Diodes SIP-3 Bulk Pack, 1.27mm Pitch (http://www.allegromicro.com/~/media/Files/Datasheets/A1369-Datasheet.ashx Allegro Microsystems 24-Lead Plastic Shrink Small Outline Package (MS) [MSOP], variant of 8-lead surface-mounted (SMD) DIP package, row spacing 7.62 mm (300 mils), see https://ac-dc.power.com/sites/default/files/product-docs/tinyswitch-iii_family_datasheet.pdf PowerIntegrations variant of 8-lead surface-mounted (SMD) DIP package, row spacing 22.86 mm (900 mils), SMDSocket, SmallPads 5-lead though-hole mounted DIP package, row spacing 15.24 mm (600 mils), Socket 24-lead though-hole mounted DIP package, row spacing 7.62 mm (300 mils), body size 10.8x26.96mm 10x-dip-switch SPST Omron_A6S-1010x, Slide, row spacing 10.16 mm (400 mils), LongPads 6-lead though-hole mounted DIP package, row spacing 16.51 mm (650 mils), SMDSocket, LongPads 48-lead though-hole mounted DIP package, row spacing 7.62 mm (300 mils), Socket THT DIP DIL PDIP 2.54mm 22.86mm 900mil LongPads 64-lead though-hole mounted DIP package, row spacing 7.62 mm (300 mils), Socket THT DIP DIL PDIP 2.54mm 7.62mm 300mil Three phase, Bridge, Rectifier 4-lead round diode bridge OnSemi SDIP-4L, see https://www.onsemi.com/pdf/datasheet/df10s1-d.pdf OnSemi Diode Bridge SDIP-4L SMD diode bridge 9.0mm 8.85mm WOB pitch 5.08mm length 9.5mm diameter 5.2mm Diode, DO-201AE series, Axial, Horizontal, pin pitch=25.4mm, 1W.

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