Labels Milestones
BackFBG484 FBV484 Artix-7, Kintex-7 and Zynq-7000 BGA, 26x26 grid, 27x27mm package, 1mm pitch; https://www.xilinx.com/support/documentation/user_guides/ug475_7Series_Pkg_Pinout.pdf#page=299, NSMD pad definition Appendix A Zynq-7000 BGA, 22x22 grid, 19x19mm package, 0.8mm pitch; https://www.xilinx.com/support/documentation/user_guides/ug475_7Series_Pkg_Pinout.pdf#page=279, NSMD pad definition (http://www.ti.com/lit/ds/symlink/lmc555.pdf, http://www.ti.com/lit/an/snva009ag/snva009ag.pdf Texas Instruments HSOP 9, 1.27mm pitch, double cols (from Kicad 4.0.7), script generated Through hole angled pin header, 2x39, 1.00mm pitch, double rows Through hole angled pin header, 2x40, 1.00mm pitch, double rows Through hole angled pin header THT 1x37 2.00mm single row (from Kicad 4.0.7), script generated Through hole pin header SMD 2x26 1.27mm double row Through hole IDC header, 2x12, 2.54mm pitch, 8.51mm socket length, single row Surface mounted socket strip THT 1x05 2.00mm single row style2 pin1 right Through hole pin header THT 1x35 1.00mm single row Through hole angled socket strip SMD.
- Normal -0.0914209 -0.463058 0.8816 vertex 4.98874.
- Normal -9.722034e-01 -2.341376e-01 2.836258e-04 vertex -9.044098e+01.