synth_tools

Back

From: http://datasheets.avx.com/F72-F75.pdf), generated with kicad-footprint-generator ipc_noLead_generator.py QFN, 40 Pin (http://www.ti.com/lit/ds/symlink/msp430g2755.pdf#page=70 JEDEC MO-220 variant VEED-6), generated with kicad-footprint-generator JST EH series connector, 202396-1007 (http://www.molex.com/pdm_docs/sd/2023960207_sd.pdf), generated with kicad-footprint-generator Molex JAE 0.2mm pitch, 1mm overall height FFC/FPC connector, 10 top-side contacts, 0.5mm pitch, SMT, https://www.te.com/commerce/DocumentDelivery/DDEController?Action=showdoc&DocId=Customer+Drawing%7F1734839%7FC%7Fpdf%7FEnglish%7FENG_CD_1734839_C_C_1734839.pdf%7F4-1734839-0 TE FPC connector, 08 top-side contacts, 0.5mm pitch, 1.854mm thermal pad HTSSOP32: plastic thin shrink small outline package; 16 leads; body width 7.5 mm; (see NXP SSOP-TSSOP-VSO-REFLOW.pdf and sot337-1_po.pdf SSOP16: plastic shrink small outline package; 20 leads; body width 6.1 mm; lead pitch 0.635; (see NXP SSOP-TSSOP-VSO-REFLOW.pdf and sot337-1_po.pdf SSOP16: plastic shrink small outline package; 24 leads; body width 4.4 mm (see NXP sot054_po.pdf TO-92 leads in-line, narrow, oval pads, drill 0.75mm (see e.g. Https://www.ctscorp.com/wp-content/uploads/206-208.pdf 8x-dip-switch SPST , Slide, row spacing 7.62 mm (300 mils), http://multimedia.3m.com/mws/media/494546O/3mtm-dip-sockets-100-2-54-mm-ts0365.pdf 3M 40-pin zero insertion force socket, through-hole, row spacing 15.24 mm (600 mils), LongPads 32-lead though-hole mounted DIP package, row spacing 15.24 mm (600 mils), LongPads 20-lead though-hole mounted DIP package, row spacing 25.4 mm (1000 mils 64-lead though-hole mounted DIP package, row spacing 7.62 mm (300 mils), body size 6.7x16.8mm (see e.g. Https://www.ctscorp.com/wp-content/uploads/204.pdf), SMD SMD 6x-dip-switch SPST Omron_A6S-610x, Slide, row spacing 8.61 mm (338 mils), body size 9.78x19.96mm (see e.g. Https://www.ctscorp.com/wp-content/uploads/219.pdf), SMD, LowProfile, JPin SMD 6x-dip-switch SPST KingTek_DSHP06TJ, Slide, row spacing 7.62 mm (300 mils 24-lead though-hole mounted DIP package, row spacing 7.62 mm (300 mils 14-lead though-hole mounted DIP package, row spacing 7.62 mm (300 mils 32-lead surface-mounted (SMD) DIP package, row spacing 7.62 mm (300 mils), LongPads 10-lead though-hole mounted DIP package, row spacing 7.62 mm (300 mils), http://multimedia.3m.com/mws/media/494546O/3mtm-dip-sockets-100-2-54-mm-ts0365.pdf Open Source Hardware Symbol Open Source Hardware Symbol Open Source Hardware Logo Polarity Center Negative Logo Polarity Center Positive Restriction of Hazardous Substances Directive Logo Symbol, Attention, Copper Top, Small, Symbol, Highvoltage, Type 1, Gauge Massstab 50mm CopperTop Type 1 Gauge, Massstab, 10mm, SilkScreenTop, Type 3, Gauge Massstab 10mm SilkScreenTop Type 2 SMT capacitor, aluminium electrolytic, 3x5.3, Cornell Dubilier Electronics SMD capacitor, aluminum electrolytic, Nichicon, 5.0x5.3mm SMD capacitor, aluminum electrolytic, Panasonic, 4.0x5.8mm SMD capacitor, aluminum electrolytic, Vishay 1816, 18.0x17.5mm, http://www.vishay.com/docs/28395/150crz.pdf SMD capacitor, aluminum electrolytic, Panasonic B6, 5.0x5.9mm SMD capacitor, aluminum electrolytic nonpolar, 8.0x5.4mm SMD capacitor, aluminum electrolytic, Vishay 1816, 18.0x17.5mm, http://www.vishay.com/docs/28395/150crz.pdf SMD capacitor, aluminum electrolytic, Nichicon, 5.0x3.9mm SMD capacitor, aluminum electrolytic, Nichicon, 5.0x5.3mm SMD capacitor, aluminum electrolytic, United Chemi-Con, 6.3x5.7mm SMD capacitor, aluminum electrolytic.

New Pull Request

Labels Milestones