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WLCSP-36, ST die ID 450, 4.96x4.64mm, 156 Ball, 13x12 Layout, 0.35mm Pitch, https://www.ti.com/lit/ml/mxbg383/mxbg383.pdf, https://www.ti.com/lit/ds/symlink/tps62800.pdf Texas Instruments, DSBGA, area grid, NSMD pad definition (http://www.ti.com/lit/ds/symlink/txs0104e.pdf, http://www.ti.com/lit/an/snva009ag/snva009ag.pdf Texas Instruments HSOP 9, 1.27mm pitch, double rows Through hole straight socket strip, 2x15, 2.00mm pitch, double cols (from Kicad 4.0.7), script generated Through hole angled socket strip, 2x03, 1.27mm pitch, 4.0mm pin length, single row Through hole angled pin header, 1x02, 1.00mm pitch, single row style2 pin1 right Through hole angled socket strip SMD 1x15 2.00mm single row style2 pin1 right Through hole angled pin header, 2x08, 2.54mm pitch, double rows Surface mounted socket strip THT 2x31 2.00mm double row surface-mounted straight pin header, 2x24.

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