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S13B-PH-K (http://www.jst-mfg.com/product/pdf/eng/ePH.pdf), generated with kicad-footprint-generator JST ZE series connector, LY20-26P-DLT1, 13 Circuits (http://www.jae.com/z-en/pdf_download_exec.cfm?param=SJ038187.pdf), generated with kicad-footprint-generator ipc_gullwing_generator.py TSSOP, 40 Pin (https://www.jedec.org/standards-documents/docs/mo-142-d variation DB), generated with kicad-footprint-generator Molex KK 396 Interconnect System, old/engineering part number: A-41791-0016 example for new part number: A-41791-0004 example for new mpn: 39-28-904x, 2 Pins per row (https://www.molex.com/pdm_docs/sd/430450201_sd.pdf), generated with kicad-footprint-generator Molex MicroClasp Wire-to-Board System, 55935-0310, with PCB locator, 3 Pins per row (http://www.molex.com/pdm_docs/sd/530470610_sd.pdf), generated with kicad-footprint-generator connector Hirose DF13 through hole, DF13-09P-1.25DS, 9 Pins (https://www.molex.com/pdm_docs/sd/026605050_sd.pdf), generated with kicad-footprint-generator Molex MicroClasp Wire-to-Board System, 55932-1010, with PCB locator, 10 Pins per row (https://cdn.harwin.com/pdfs/M20-781.pdf), generated with kicad-footprint-generator Soldered wire connection with feed through strain relief, for a single 1.5 mm² wires, basic insulation, conductor diameter 1.7mm, size source.

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