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Package (ML) - 8x8x0.9 mm Body [DFN] (see Microchip Packaging Specification 00000049BS.pdf 48-Lead Thin Quad Flatpack (PH) - 16x16x1 mm Body, 2.00 mm Footprint [TQFP] thermal pad LQFP, 32 Pin (http://ww1.microchip.com/downloads/en/DeviceDoc/8008S.pdf#page=20.

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