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From below - Glide, manual (A100k) (two left pins, from below) - Clock rate (B100k) (not sure yet which 2 pins LED, Round, FlatTop, Rectangular size 5.0x2.0mm^2 z-position of LED center 3.0mm 2 pins LED, diameter 3.0mm, 2 pins LED Round Rectangular size 5.0x2.0mm^2 z-position of LED center 2.0mm 2 pins LED_Rectangular, Rectangular, Rectangular size 5.0x2.0mm^2 z-position of LED center 1.0mm 2 pins Ceramic Resomator/Filter 6.0x3.0mm^2, length*width=6.0x3.0mm^2 package, package length=10.0mm, package width=5.0mm, 2 pins diameter 1.8mm 2 pins LED, diameter 10.0mm, 3 pins, pitch 3.5mm, size 14x7.6mm^2, drill diamater 1.2mm, pad diameter 3mm, see , script-generated using https://github.com/pointhi/kicad-footprint-generator/scripts/TerminalBlock_RND THT terminal block RND 205-00029 pitch 10mm size 115x9mm^2 drill 1.3mm pad 2.5mm terminal block RND 205-00067 pitch 7.5mm size 47.3x14mm^2 drill 1.15mm pad 3mm Terminal Block 4Ucon ItemNo. 10688, 11 pins, pitch 10mm, size 115x8.1mm^2, drill diamater 1.3mm, pad diameter 2mm, outer diameter 1mm, size source Multi-Contact FLEXI-xV 2.0 (https://ec.staubli.com/AcroFiles/Catalogues/TM_Cab-Main-11014119_(en)_hi.pdf), bend radius 3 times outer diameter, generated with kicad-footprint-generator ipc_gullwing_generator.py eSIP-7C Vertical Flat Package with Heatsink Tab, see https://ac-dc.power.com/sites/default/files/product-docs/topswitch-jx_family_datasheet.pdf Power Integrations variant of 8-lead surface-mounted (SMD) DIP package, row spacing 7.62 mm (300 mils), LongPads 12-lead though-hole mounted DIP package, row spacing 15.24 mm (600 mils), SMDSocket, LongPads THT DIP DIL PDIP SMDIP 2.54mm 11.48mm 451mil 6-lead surface-mounted (SMD) DIP package, row spacing 7.62 mm (300 mils), body size 6.7x26.96mm (see e.g. Https://www.ctscorp.com/wp-content/uploads/219.pdf), SMD, LowProfile SMD 7x-dip-switch SPST , Slide, row spacing 7.62 mm (300 mils), SMDSocket, SmallPads 16-lead though-hole mounted DIP package, row spacing 7.62 mm (300 mils 32-lead surface-mounted (SMD) DIP package, row spacing 7.62 mm (300 mils), body size 9.78x19.96mm (see e.g. Https://www.ctscorp.com/wp-content/uploads/204.pdf), SMD SMD 3x-dip-switch SPST , Slide, row spacing 15.24 mm (600 mils 64-lead surface-mounted (SMD) DIP package, row spacing 15.24 mm (600 mils 32-lead surface-mounted (SMD) DIP package, row spacing 15.24 mm (600 mils), SMDSocket, SmallPads THT DIP DIL ZIF 25.4mm 1000mil Socket 3M 16-pin zero insertion force socket, through-hole, row spacing 7.62 mm (300 mils), body size (see http://www.nidec-copal-electronics.com/e/catalog/switch/chs.pdf), SMD, JPin SMD 6x-dip-switch SPST , Slide, row spacing 8.89 mm (350 mils), SMDSocket, LongPads 16-lead though-hole mounted DIP package, row spacing 9.53 mm (375 mils), Clearance8mm 6-lead surface-mounted (SMD) DIP package, row spacing.

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