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1
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1.448x1.468mm, 9 Ball, 3x3 Layout, 0.4mm Pitch, http://www.st.com/content/ccc/resource/technical/document/technical_note/92/30/3c/a1/4c/bb/43/6f/DM00103228.pdf/files/DM00103228.pdf/jcr:content/translations/en.DM00103228.pdf pSemi CSP-16 1.64x2.04x0.285mm (http://www.psemi.com/pdf/datasheets/pe29101ds.pdf, http://www.psemi.com/pdf/app_notes/an77.pdf UFD Package, 4-Lead Plastic Stretched Small Outline Narrow Body (QR)-.150" Body [QSOP] (see Microchip Packaging Specification 00000049BS.pdf UQFN, 16 Pin (http://www.ti.com/lit/ds/symlink/ina3221.pdf#page=44), generated with kicad-footprint-generator Tantalum Capacitor SMD Kemet-D (7343-31 Metric), IPC_7351 nominal, (Body size source: http://www.tortai-tech.com/upload/download/2011102023233369053.pdf), generated with kicad-footprint-generator Molex KK 396 Interconnect System, old/engineering part number: AE-6410-12A example for new part number: AE-6410-04A example for new part number: A-41792-0009 example for new part number: A-41792-0012 example for new part number: 26-60-5150, 15 Pins.

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