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TFBGA-64, 8x8 raster, 4.466x4.395mm package, pitch 0.4mm; see section 6.3 of http://www.st.com/resource/en/datasheet/stm32f103ze.pdf WLCSP-64, 8x8 raster, 3.357x3.657mm package, pitch 0.4mm; see section 6.6 of http://www.st.com/resource/en/datasheet/DM00273119.pdf X1-WLB0909, 0.89x0.89mm, 4 Ball, 2x2 Layout, 0.35mm Pitch, https://www.onsemi.com/pdf/datasheet/ncp163-d.pdf#page=23 6pin Pitch 0.4mm 8-Lead Plastic DFN (3mm x 3mm) (see Linear Technology DFN_16_05-08-1709.pdf DHC Package; 18-Lead Plastic DFN (3mm x 2mm) 0.40mm pitch DDB Package; 8-Lead Plastic Stretched Small Outline (SN) - Narrow, 3.90 mm Body [SOIC], pin 7 removed (Microchip Packaging Specification 00000049BS.pdf 8-Lead Plastic Dual Flat No Lead Package (MF) - 6x5 mm Body [QFN]; (see Microchip Packaging Specification 00000049BS.pdf SSOP, 32 Pin (https://www.espressif.com/sites/default/files/documentation/0a-esp8285_datasheet_en.pdf), generated with kicad-footprint-generator Molex MicroClasp Wire-to-Board System, 55932-0310, with PCB locator, 14 Pins (http://www.molex.com/pdm_docs/sd/559320530_sd.pdf), generated with kicad-footprint-generator JST SUR top entry Molex SlimStack Fine-Pitch SMT Board-to-Board Connectors, 502426-2410, 24 Pins per row (https://www.hirose.com/product/en/products/FH12/FH12-24S-0.5SH(55)/), generated with StandardBox.py) (Keystone Battery Holder, 2479, Battery.

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