synth_tools

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Fm_in = [h_margin+working_width/8, row_2, 0]; fm_lvl = [h_margin+working_width/8, row_2, 0]; cv_2b_atten = [right_col, row_3, 0]; pwm_duty = [width_mm - h_margin - working_width/8, row_4, 0]; left_rib_x = thickness + 6 + tolerance; // rib + half a jack col_right = width_mm - 10 LEDs - one per step // 1 for manual step (sw13) - pushbutton // glide atten (rv15 // 13 SPDT switches (many used as SPST - 2 x switching (normalling) stereo jack without switching contact, horizontal PCB mount, https://www.neutrik.com/en/product/nc3mav-0 A Series, 4 pole chassis connector, grey D-size flange, countersunk thru holes, vertical PCB mount, https://www.neutrik.com/en/product/nc3mbh-0 B Series, 3 pole male XLR receptacle, grounding: separate ground contact to mating connector shell to pin1 and front panel, lateral left PCB mount, https://www.neutrik.com/en/product/nl4md-v speakON Chassis Connectors, 4 pole chassis connector, black D-size flange, countersunk thru holes, vertical PCB mount, https://www.neutrik.com/en/product/nc3fahr2 A Series, 3 pole male XLR receptacle, grounding: separate ground contact connected to EP (http://www.aosmd.com/res/packaging_information/DFN5x6_8L_EP1_P.pdf 56-Lead Plastic Quad Flatpack (PH) - 16x16x1 mm Body, 2.00 mm [TQFP] (see Microchip Packaging Specification 00000049BS.pdf, http://www.onsemi.com/pub/Collateral/NCP1207B.PDF 8-Lead Plastic WSON, 4x3mm Body, 0.5mm Pitch, https://www.diodes.com/assets/Datasheets/AP22913.pdf WLCSP-4, 0.64x0.64mm, 4 Ball, 2x2 Layout, 0.5mm Pitch, https://www.st.com/resource/en/datasheet/stm32wb55vc.pdf ST WLCSP-100, ST die ID 471, 4.437x4.456mm, 100 Ball, 10x10 Layout, 0.4mm Pitch, https://www.st.com/resource/en/datasheet/stm32u575og.pdf#page=306 ST WLCSP-100, ST die ID 482, 4.2x3.95mm, 90 Ball, X-staggered 7x5 Layout, 0.4mm Pitch, https://www.st.com/resource/en/datasheet/stm32g071eb.pdf ST WLCSP-36, ST die ID 460, 2.3x2.48mm, 25 Ball, 5x5 Layout, 0.4mm Pitch, https://pdfserv.maximintegrated.com/package_dwgs/21-100168.PDF XBGA-121, 11x11 raster, 10x10mm package, pitch 0.4mm; see section 6.8 of http://www.st.com/resource/en/datasheet/stm32f746zg.pdf WLCSP-144, 12x12 raster, 10x10mm package, pitch 0.8mm Altera BGA-68 M68 MBGA Altera VBGA V81 BGA-81 Altera BGA-100 M100 MBGA 121-ball, 0.8mm BGA (based on standard DIP-4), row spacing 11.48 mm (451 mils 8-lead though-hole mounted DIP package, row spacing 7.62 mm (300 mils), LongPads 24-lead though-hole mounted DIP package, row spacing 8.61 mm (338 mils), body size 9.78x32.66mm (see e.g. Https://www.ctscorp.com/wp-content/uploads/209-210.pdf), LowProfile 12x-dip-switch SPST CTS_Series194-12MSTN, Piano, row spacing 15.24 mm (600 mils), SMDSocket, LongPads 32-lead though-hole mounted DIP package, row spacing 8.61 mm (338 mils), body size 9.78x12.34mm (see e.g. Https://www.ctscorp.com/wp-content/uploads/219.pdf), SMD, LowProfile, JPin SMD 6x-dip-switch SPST KingTek_DSHP06TS, Slide, row spacing 7.62 mm (300 mils), body size 9.78x12.34mm (see e.g. Https://www.ctscorp.com/wp-content/uploads/219.pdf), SMD, LowProfile, JPin SMD 3x-dip-switch SPST Copal_CVS-03xB, Slide, row spacing 9.53 mm (375 mils 10-lead though-hole mounted DIP package, row spacing 7.62 mm (300 mils 6-lead surface-mounted (SMD) DIP package, row spacing 7.62 mm (300 mils), LongPads 64-lead though-hole mounted DIP package, row spacing 16.51 mm (650 mils.

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