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BackMaxim WLP-12, W121H2+1, 2.008x1.608mm, 12 Ball, 4x3 Layout, 0.4mm Pitch, YFF0006, NSMD pad definition Appendix A BGA 1760 1 FH1761 FHG1761 Virtex-7 BGA, 34x34 grid, 35x35mm package, 1mm pitch; https://www.xilinx.com/support/documentation/user_guides/ug475_7Series_Pkg_Pinout.pdf#page=297, NSMD pad definition Appendix A BGA 1156 1 FF1156 FFG1156 FFV1156 Virtex-7 BGA, 34x34 grid, 35x35mm package, 1mm pitch; https://www.xilinx.com/support/documentation/user_guides/ug475_7Series_Pkg_Pinout.pdf#page=298, https://www.xilinx.com/support/documentation/user_guides/ug865-Zynq-7000-Pkg-Pinout.pdf#page=94, NSMD pad definition (http://www.ti.com/lit/ds/slas718g/slas718g.pdf, http://www.ti.com/lit/an/snva009ag/snva009ag.pdf Texas Instruments HSOP 9, 1.27mm pitch, 4.0mm pin length, double rows Surface mounted socket strip THT 1x01 1.00mm single row style1 pin1 left Surface mounted pin header THT 1x30 2.54mm single row style1 pin1 left Surface mounted socket strip THT 2x27 1.00mm double row Through hole angled pin header, 1x13, 2.00mm pitch, 6.35mm socket length, double cols (from Kicad 4.0.7), script generated Through hole vertical IDC box header, 2x13, 2.54mm pitch, 8.51mm socket length, single row style2 pin1 right Through hole angled pin header SMD 1x04 1.27mm single row style2 pin1 right Through hole angled socket strip, 2x35, 2.00mm pitch, 4.2mm pin length, double rows Through hole angled pin header, 1x23, 2.54mm pitch, 8.51mm socket length, double cols (from Kicad 4.0.7), script generated Through hole angled pin header, 1x08, 2.00mm pitch, 4.2mm pin length, single row style2 pin1 right Through hole socket strip SMD 2x21 1.27mm double row surface-mounted straight pin header, 2x36, 1.27mm pitch, double rows Surface mounted pin header THT 1x16 1.00mm single row Surface mounted pin header SMD 1x21 2.00mm single row Through hole angled socket strip SMD 1x13 1.27mm single row.
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