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Mils), see https://www.power.com/sites/default/files/product-docs/lnk520.pdf SMD DIP DIL PDIP 2.54mm 25.4mm 1000mil 40-lead though-hole mounted DIP package, row spacing 5.08mm, pin-spacing 2.54mm, see http://ww1.microchip.com/downloads/en/DeviceDoc/20005685A.pdf.

(1608-08 Metric), IPC_7351 nominal, (Body size.
0.8 CSGA225 Spartan-7 BGA, 14x14 grid, 8x8mm package.
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HLE-112-02-xxx-DV-LC, 12 Pins per.

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