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Https://www.thisisant.com/assets/resources/D00001687_D52_Module_Datasheet.v.2.3_(Garmin).pdf RF SoC Radio ANT Bluetooth BLE D52 nRF52 Garmin Canada Dynastream Nordic Low Power Long Range Transceiver Module LoRa Radio, RF, Module, http://www.hoperf.com/upload/rf/RFM69HW-V1.3.pdf 8 pin SIM connector for 1.6mm PCB's with 08 contacts (polarized Highspeed card edge connector for 2.4mm PCB's with 05 contacts (not polarized Highspeed card edge card connector socket for 2.36mm PCBs, vertical, alignment pins, weld tabs (source: https://suddendocs.samtec.com/prints/hsec8-1xxx-xx-xx-dv-x-xx-footprint.pdf Samtec Micro Mate Discrete Wire Terminal Strip, 1.00 mm Pitch, Single Row, Vertical (source: https://suddendocs.samtec.com/prints/t1m-single-row-footprint.pdf Samtec Micro Mate Discrete Wire Terminal Strip, 1.00 mm Pitch, Single Row, Horizontal, Latch (source: https://suddendocs.samtec.com/prints/t1m-single-row-footprint.pdf conn samtec card-edge high-speed Highspeed card edge connector for 1.6mm PCB's with 08 contacts (polarized Highspeed card edge card connector socket for 2.36mm PCBs, vertical, alignment pins, weld tabs, board locks (source: https://suddendocs.samtec.com/prints/hsec8-1xxx-xx-xx-dv-x-xx-footprint.pdf 0.8 mm Highspeed card edge connector for 2.4mm PCB's with 08 contacts (not polarized Highspeed card edge card connector socket for 1.57mm PCBs, vertical (source: https://suddendocs.samtec.com/prints/hsec8-1xxx-xx-xx-dv-x-xx-footprint.pdf 0.8 mm BGA-64, 10x10 raster, 8x8mm package, 0.5mm pitch; https://www.xilinx.com/support/documentation/user_guides/ug475_7Series_Pkg_Pinout.pdf#page=266, NSMD pad definition Appendix A BGA 1156 1 FF1157 FFG1157 FFV1157 FF1158 FFG1158 FFV1158 Virtex-7 BGA, 42x42 grid, 45x45mm package, 1mm pitch; https://www.xilinx.com/support/documentation/user_guides/ug475_7Series_Pkg_Pinout.pdf#page=299, NSMD pad definition Appendix A BGA 484 0.8 RS484 Artix-7 BGA, 22x22 grid, 19x19mm package, 0.8mm pitch; https://www.xilinx.com/support/documentation/user_guides/ug865-Zynq-7000-Pkg-Pinout.pdf#page=80, NSMD pad definition Appendix A Virtex-7 BGA, 34x34 grid, 35x35mm package, 1mm pitch; https://www.xilinx.com/support/documentation/user_guides/ug475_7Series_Pkg_Pinout.pdf#page=265, NSMD pad definition (http://www.ti.com/lit/ds/slas718g/slas718g.pdf, http://www.ti.com/lit/an/snva009ag/snva009ag.pdf Texas Instruments HSOP 9, 1.27mm pitch, double rows Surface mounted pin header THT 2x11 1.27mm double row Through hole straight pin header, 2x19, 1.00mm pitch, 2.0mm pin length, double rows Through hole socket strip SMD 1x37 2.00mm single row Through hole angled socket strip, 1x25, 2.54mm pitch, 8.51mm socket length, double cols (from Kicad 4.0.7), script generated Through hole IDC header, 2x10, 2.54mm pitch, double rows Through hole angled pin header THT 2x06.

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