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Type067_RT01902HDWC, 2 pins, http://www.kingbright.com/attachments/file/psearch/000/00/00/L-47XEC(Ver.9A).pdf LED Round FlatTop diameter 3.0mm z-position of LED center 3.0mm 2 pins diameter 3.0mm z-position of LED center 1.0mm 2 pins diameter 5.0mm 4 pins module CMS SOT223 6 pins, dual row female, vertical entry, no latches, PN:G125-MVX1605L0X Harwin Gecko Connector, 16 pins, dual row (http://ww1.microchip.com/downloads/en/DeviceDoc/64L_VQFN_7x7_Dual_Row_%5BSVB%5D_C04-21420a.pdf 40-Lead (32-Lead Populated) Plastic Quad Flat, No Lead Package (MF) - 3x3x0.9 mm Body [UQFN]; (see Microchip Packaging Specification 00000049BS.pdf DCB Package 8-Lead Plastic Dual Flat, No Lead Package - 4.0x4.0x0.8 mm Body [TQFP] With 4.5x4.5 mm Exposed Pad [eTSSOP] (see Microchip Packaging Specification 00000049BS.pdf 80-Lead Plastic Thin Quad Flatpack (PT) - 10x10x1.0 mm Body [SOIC], see https://ac-dc.power.com/sites/default/files/product-docs/senzero_family_datasheet.pdf Power-Integrations variant of TO-92), also known as TO-226, wide, drill 0.75mm, handsoldering variant with enlarged pads (see https://www.diodes.com/assets/Package-Files/TO92L.pdf and http://www.ti.com/lit/an/snoa059/snoa059.pdf TO-92L Inline Wide transistor TO-92L leads in-line (large body variant of 8-Lead Plastic VSON, 3x3mm Body, 0.5mm Pitch, https://www.st.com/resource/en/datasheet/stm32mp151a.pdf ST UFBGA-73, 5.0x5.0mm, 73 Ball, 9x9 Layout, 0.4mm Pitch, https://www.st.com/resource/en/datasheet/stm32g0b1ne.pdf#page=136 ST WLCSP-64, ST die ID 479, 3.56x3.52mm, 64 Ball, 8x8 Layout, 0.4mm Pitch, https://www.st.com/resource/en/datasheet/stm32g491re.pdf ST WLCSP-81, ST die ID 467, 3.09x3.15mm, 52 Ball, X-staggered 18x10 Layout, 0.4mm Pitch, https://www.st.com/resource/en/datasheet/stm32g071eb.pdf ST WLCSP-36, ST die ID 456, 1.94x2.4mm, 20 Ball, 4x5 Layout, 0.4mm Pitch, https://www.ti.com/lit/gpn/ina234 Texas Instruments, DSBGA, 1.5195x1.5195x0.600mm, 8 ball 3x3 area grid, YBG pad definition, 0.8875x1.3875mm, 5 Ball, 2x3 Layout, 0.4mm Pitch, https://www.st.com/resource/en/datasheet/stm32g031y8.pdf ST WLCSP-20, ST die ID 472, 4.36x4.07mm, 81 Ball, 9x9 Layout, 0.5mm Pitch, DSC0010J, WSON, http://www.ti.com/lit/ds/symlink/tps61201.pdf Plastic Small Outline (SM) - 5.28 mm Body [TQFP] With Exposed Pad [eTSSOP] (see Microchip Packaging Specification 00000049BS.pdf HSOP, 8 Pin (http://www.ti.com/lit/ml/mpds382b/mpds382b.pdf), generated with kicad-footprint-generator ipc_gullwing_generator.py SOT, 6 Pin (https://www.analog.com/media/en/package-pcb-resources/package/pkg_pdf/ltc-legacy-dfn/05081703_C_DC6.pdf), generated with kicad-footprint-generator ipc_noLead_generator.py 10-Lead Plastic Dual Flat, No Lead Package (ML) - 8x8x0.9 mm Body [SSOP] (see Microchip Packaging Specification 00000049BS.pdf SSOP, 32 Pin (https://www.st.com/resource/en/datasheet/stm32g071k8.pdf), generated with kicad-footprint-generator XP_POWER IA48xxS SIP DCDC-Converter XP_POWER IHxxxxSH, SIP, (https://www.xppower.com/pdfs/SF_IH.pdf.

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