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488A ON Semiconductor Micro8 (Case846A-02): https://www.onsemi.com/pub/Collateral/846A-02.PDF PSOP44: plastic thin shrink small outline package; 28 leads; body width 16.90 mm Power-Integrations variant of 8-Lead Plastic Dual Flat, No Lead Package (JQ) - 4x4x0.5 mm Body [WSON], http://www.ti.com/lit/ml/mpds421/mpds421.pdf WSON-16 3.3 x 1.35mm Pitch 0.4mm http://www.chip.tomsk.ru/chip/chipdoc.nsf/Package/C67E729A4D6C883A4725793E004C8739!OpenDocument WSON-16 3.3 x 1.35mm Pitch 0.4mm http://www.ti.com/lit/ds/symlink/txb0108.pdf USON-20 2x4mm Pitch 0.4mm WLCSP WLCSP/XFBGA 8-pin package, staggered pins, http://www.adestotech.com/wp-content/uploads/DS-AT25DF041B_040.pdf WLCSP WLCSP-8 XFBGA XFBGA-8 CSP BGA Chip-Scale Glass-Top WLCSP-8, 2.284x1.551mm, 8 Ball.

Length*width=9*9.8mm^2, Capacitor, https://en.tdk.eu/inf/20/20/db/fc_2009/MKT_B32560_564.pdf C.
Normal 0.471394 -0.881923 0 vertex -7.20568 -7.20568 2.19603.
-5.555562e-01 -8.314790e-01 -0.000000e+00 facet normal 0.884723 -0.222395 0.409641.
-1.047732e+02 9.665134e+01 9.412657e+00 facet.

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