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BackOut 2x Toggle Switches, 2pin: - reset Pots, 3-pin: Glide attenuator (B10k) (join two left pins from below Clock rate (B100k) (not sure yet which 2 pins diameter 5.0mm z-position of LED center 2.0mm, 2 pins, http://www.kingbright.com/attachments/file/psearch/000/00/00/L-1034IDT(Ver.9A).pdf LED Round FlatTop diameter 5.0mm z-position of LED center 1.0mm, 2 pins, http://www.kingbright.com/attachments/file/psearch/000/00/00/L-13GD(Ver.11B).pdf LED Round Rectangular size 5.0x2.0mm^2 z-position of LED center 1.0mm 2 pins THT ceramic resonator filter DSS6 SMD Resomator/Filter Murata CDSCB, http://cdn-reichelt.de/documents/datenblatt/B400/SFECV-107.pdf, 4.5x2.0mm^2 package SMD Crystal SERIES SMD2016/4 http://www.q-crystal.com/upload/5/2015552223166229.pdf, 2.0x1.6mm^2 package SMD Crystal Oscillator Seiko Epson SG-3030CM package SMD Crystal Oscillator Seiko Epson MC-506 http://media.digikey.com/pdf/Data%20Sheets/Epson%20PDFs/MA-505,506.pdf, 11.7x4.0mm^2 package SMD Crystal Oscillator Seiko Epson SG-8002JC https://support.epson.biz/td/api/doc_check.php?mode=dl⟨=en&Parts=SG-8002DC, 10.5x5.0mm^2 package SMD Crystal FC-135 https://support.epson.biz/td/api/doc_check.php?dl=brief_FC-135R_en.pdf SMD Crystal Seiko Epson SG-8002JC https://support.epson.biz/td/api/doc_check.php?mode=dl⟨=en&Parts=SG-8002DC, 10.5x5.0mm^2 package SMD Crystal Oscillator Seiko Epson SG-8002JA https://support.epson.biz/td/api/doc_check.php?mode=dl&lang=en&Parts=SG-8002DC, hand-soldering, 10.5x5.0mm^2 package SMD Crystal Oscillator Seiko Epson SG-210 https://support.epson.biz/td/api/doc_check.php?mode=dl⟨=en&Parts=SG-210SED, 2.5x2.0mm^2 package SMD Crystal Seiko Epson MC-506 http://media.digikey.com/pdf/Data%20Sheets/Epson%20PDFs/MA-505,506.pdf, hand-soldering, 12.7x5.1mm^2 package SMD Resomator/Filter Murata TPSKA, http://cdn-reichelt.de/documents/datenblatt/B400/SFECV-107.pdf, hand-soldering, 6.9x2.9mm^2 package SMD Crystal Oscillator Seiko Epson MC-506 http://media.digikey.com/pdf/Data%20Sheets/Epson%20PDFs/MA-505,506.pdf, hand-soldering, 12.7x5.1mm^2 package SMD Crystal EuroQuartz X22 series http://cdn-reichelt.de/documents/datenblatt/B400/DS_X22.pdf, 2.5x2.0mm^2 package crystal Epson Toyocom FA-128 (https://support.epson.biz/td/api/doc_check.php?dl=brief_FA-128&lang=en), 2x1.6mm^2 package SMD SMT mems oscillator Analog BGA-49, 6.25x6.25mm, 49 Ball, 7x7 Layout, 0.4mm Pitch, YFF0006, NSMD pad definition Appendix A BGA 1156 1 FF1157 FFG1157 FFV1157 FF1158 FFG1158 FFV1158 Virtex-7 BGA, 44x44 grid, 45x45mm package, 1mm pitch; https://www.xilinx.com/support/documentation/user_guides/ug475_7Series_Pkg_Pinout.pdf#page=275, NSMD pad definition Appendix A BGA 484 0.8 SB484 SBG484 SBV484 Zynq-7000 BGA, 34x34 grid, 35x35mm package, 1mm pitch; https://www.xilinx.com/support/documentation/user_guides/ug475_7Series_Pkg_Pinout.pdf#page=265, NSMD pad definition Appendix A BGA 676 1 FG676 FGG676 Spartan-7 BGA, 22x22 grid, 23x23mm package, 1mm pitch; https://www.xilinx.com/support/documentation/user_guides/ug475_7Series_Pkg_Pinout.pdf#page=264, NSMD pad definition Appendix A BGA 900 1 FB900 FBG900 FBV900 Kintex-7 and Zynq-7000 BGA, 30x30 grid, 31x31mm package, 1mm pitch; https://www.xilinx.com/support/documentation/user_guides/ug475_7Series_Pkg_Pinout.pdf#page=271, ttps://www.xilinx.com/support/documentation/user_guides/ug475_7Series_Pkg_Pinout.pdf#page=281, https://www.xilinx.com/support/documentation/user_guides/ug865-Zynq-7000-Pkg-Pinout.pdf#page=82, NSMD pad definition Appendix A BGA 1156 1 RF1157 RF1158 Virtex-7 BGA, 44x44 grid, 45x45mm package, 1mm pitch; https://www.xilinx.com/support/documentation/user_guides/ug865-Zynq-7000-Pkg-Pinout.pdf#page=93, NSMD pad definition Appendix A BGA 900 1 FB900 FBG900 FBV900 Kintex-7 and Zynq-7000 BGA, 22x22 grid, 19x19mm package, 0.8mm pitch; https://www.xilinx.com/support/documentation/user_guides/ug475_7Series_Pkg_Pinout.pdf#page=268, NSMD pad definition Appendix A BGA 484 1 FG484 FGG484 Artix-7 BGA, 19x19 grid, 10x10mm package, pitch 0.8mm; see section 7.2 of http://www.st.com/resource/en/datasheet/stm32f429ng.pdf UFBGA-201, 15x15 raster, 10x10mm package, pitch 0.35mm; https://datasheets.maximintegrated.com/en/ds/MAX40200.pdf WLP-9, 1.448x1.468mm, 9 Ball, 3x3 Layout, 0.4mm Pitch, https://www.st.com/resource/en/datasheet/stm32l496wg.pdf ST WLCSP-132, ST die ID 472, 4.36x4.07mm, 81 Ball, 9x9 Layout, 0.5mm Pitch, http://www.ti.com/lit/ds/symlink/txb0104.pdf, http://www.ti.com/lit/an/snva009ag/snva009ag.pdf BGA 12 0.5 R-XBGA-N12 Texas Instruments, DSBGA, 1.4715x1.4715mm, 9 bump 3x3 array, NSMD pad definition Appendix A Kintex-7 BGA, 30x30 grid, 31x31mm package, 1mm pitch; https://www.xilinx.com/support/documentation/user_guides/ug475_7Series_Pkg_Pinout.pdf#page=278, https://www.xilinx.com/support/documentation/user_guides/ug865-Zynq-7000-Pkg-Pinout.pdf#page=92, NSMD pad definition Appendix A BGA.
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