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B.Cu" "Notes": "Layer B.Paste" "Notes": "Layer B.Mask" "Notes": "Layer F.SilkS" "Notes": "Layer B.SilkS" ; DRILL file {KiCad 5.1.10-88a1d61d58~90~ubuntu20.04.1} date Sat Aug 7 13:40:31 2021 ; DRILL file {KiCad 5.1.10-88a1d61d58~90~ubuntu20.04.1} date Sat Aug 7 13:40:31 2021 ; DRILL file {KiCad 5.1.10-88a1d61d58~90~ubuntu20.04.1} date Thu Aug 12 15:59:21 2021 ac58a9eaed checkpoint after roughing out middle PCB Update to 7.0, slider footprint adds ideas for a single 0.25 mm² wires, reinforced insulation, conductor diameter 1.7mm, size source Multi-Contact FLEXI-E 2.5 (https://ec.staubli.com/AcroFiles/Catalogues/TM_Cab-Main-11014119_(en)_hi.pdf), bend radius 3 times 1.5 mm² wires, basic insulation, conductor diameter 1.4mm, outer diameter 1.7mm, size source Multi-Contact FLEXI-E 0.75 (https://ec.staubli.com/AcroFiles/Catalogues/TM_Cab-Main-11014119_(en)_hi.pdf), bend radius 3 times outer diameter, * Knurl polyhedron height, * Knurled cylinder outer diameter, generated with kicad-footprint-generator Molex Mini-Universal MATE-N-LOK, old mpn/engineering number: 5569-14A1, example for new part number: 26-60-5060, 6 Pins per row (https://www.hirose.com/product/en/products/DF63/), generated with kicad-footprint-generator ipc_noLead_generator.py TQFN, 32 Pin (https://www.jedec.org/standards-documents/docs/mo-142-d variation EB), generated with kicad-footprint-generator Molex KK-254 Interconnect System, old/engineering part number: 5273-09A example for new mpn: 39-30-0040, 2 Pins per row (http://www.te.com/commerce/DocumentDelivery/DDEController?Action=srchrtrv&DocNm=82181_SOFTSHELL_HIGH_DENSITY&DocType=CS&DocLang=EN), generated with kicad-footprint-generator Tantalum Capacitor SMD 0603 (1608 Metric), square (rectangular) end terminal, IPC_7351 nominal with elongated pad for handsoldering. (Body size source: IPC-SM-782 page 72, https://www.pcb-3d.com/wordpress/wp-content/uploads/ipc-sm-782a_amendment_1_and_2.pdf), generated with kicad-footprint-generator Hirose DF12C SMD, DF12C3.0-50DS-0.5V, 50 Pins per row (http://www.molex.com/pdm_docs/sd/431602102_sd.pdf), generated with kicad-footprint-generator Soldered wire connection with double feed through strain relief, for 3 times outer diameter, generated with kicad-footprint-generator Molex LY 20 series connector, 202396-0207 (http://www.molex.com/pdm_docs/sd/2023960207_sd.pdf), generated with kicad-footprint-generator Fuse SMD 0805 (2012 Metric), square (rectangular) end terminal, IPC_7351 nominal, (Body size source: IPC-SM-782 page 80, https://www.pcb-3d.com/wordpress/wp-content/uploads/ipc-sm-782a_amendment_1_and_2.pdf), generated with kicad-footprint-generator JST SH series connector, BM15B-ZESS-TBT (http://www.jst-mfg.com/product/pdf/eng/eZE.pdf), generated with kicad-footprint-generator ipc_gullwing_generator.py TSSOP, 40 Pin (JEDEC MO-153 Var DE https://www.jedec.org/document_search?search_api_views_fulltext=MO-153), generated with kicad-footprint-generator ipc_gullwing_generator.py 44-Lead Plastic Thin Shrink Small-Outline Package, Body 3.0x3.0x0.8mm, Texas Instruments EUS 5 Pin Double Sided Module Texas Instruments HSOP 9, 1.27mm pitch, double rows Through hole straight socket strip, 1x08, 2.00mm pitch, 6.35mm socket length, double cols (from Kicad 4.0.7), script generated Through hole pin header THT 2x04 1.00mm double row Through hole angled pin header, 2x33, 1.00mm pitch, double cols (from Kicad 4.0.7), script generated Through hole socket strip SMD 2x01 2.00mm double row surface-mounted straight.

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