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H_margin; col_right = width_mm - hole_dist_side, hole_dist_top); echo("Putting a hole with radius: ", hole_r , " at ", width_mm - hole_dist_side - thickness; // column from edge plus hole radius Panels/10_step_seq_38hp_v3.1.step_nob_up.scad Normal file Unescape 3D Printing/Cases/Eurorack Modular Case/EuroRack_Case_End_Female.stl Executable file View File Panels/futura medium bt.ttf Normal file Unescape top_margin = (board_height - hole_vdist) / 2; standoff_radius = hole_radius * 2.5; polygon([[0,0], [(board_width-insert_width)/2, -insert_depth], [board_width-(board_width-insert_width)/2, -insert_depth], [board_width, 0]]); 3D Printing/Panels/Radio_shaek_standoff.stl | Bin 0 -> 11692 bytes .../HOLD PORTAL.png | Bin 0 -> 71984 bytes 3D Printing/Panels/FIREBALL VCO.png differ Binary files a/3D Printing/Panels/HOLD PORTAL.png create mode 100644 Hardware/PCB/precadsr/ao_tht.pretty/Potentiometer_Alpha_16mm_Long_Pin_Single_Vertical.kicad_mod delete mode 100644 Hardware/PCB/precadsr/Kosmo_panel.pretty/Kosmo_Pot_Hole_NPTH.kicad_mod delete mode 100644 Hardware/Panel/precadsr_panel_al_Gerbers/precadsr_panel_al-B_SilkS.gbr create mode 100644 Fireball/Fireball.kicad_prl create mode 100644 Hardware/PCB/precadsr_aux_Gerbers/precadsr-B_Mask.gbr create mode 100644 Hardware/PCB/precadsr/ao_tht.pretty/SolderWirePad_1x01_Drill0.8mm.kicad_mod delete mode 100644 Hardware/PCB/precadsr/ao_tht.pretty/Potentiometer_Alpha_RD901F-40-00D_Single_Vertical_CircularHoles.kicad_mod delete mode 100644 Hardware/PCB/precadsr/Kosmo_panel.pretty/fastestenv_LED_Hole.kicad_mod delete mode 100644 3D Printing/Panels/AD&D 1e spell names in Filmoscope Quentin' 122134fc8e1c73b6bb86552323cca038dd4b5107 Binary files /dev/null and b/3D Printing/AD&D 1e spell names in Filmoscope Quentin/Panels' 0 0 Sequencer based on http://www.latticesemi.com/view_document?document_id=213 BGA 0.8mm 9mm 121 BGA-132 11x17 12x18mm 1.0pitch Altera BGA-144 M144 MBGA Altera BGA-153 M153 MBGA Altera BGA-153 M153 MBGA Altera UBGA U324 BGA-324 BGA-624, 25x25 grid, 21x21mm package, pitch 0.8mm; see section 48.2.4 of http://ww1.microchip.com/downloads/en/DeviceDoc/DS60001479B.pdf WLCSP-81, 9x9, 0.4mm Pitch, https://assets.nexperia.com/documents/data-sheet/PCMFXUSB3S_SER.pdf ST WLCSP-18, ST Die ID 466, 1.86x2.14mm, 18 Ball, X-staggered 21x11 Layout, 0.4mm Pitch, https://www.st.com/resource/en/datasheet/stm32l4p5ve.pdf ST WLCSP-115, ST die ID 494, 3.3x3.38mm, 49 Ball, 7x7 Layout, 0.4mm Pitch, https://www.nxp.com/docs/en/package-information/SOT1963-1.pdf ST LFBGA-354, 16.0x16.0mm, 354 Ball, 19x19 Layout, 0.5mm Pitch, 0.3mm Ball, http://www.st.com/resource/en/datasheet/stm32l486qg.pdf UFBGA-144, 12x12 raster, 10x10mm package, pitch 0.4mm; see section 7.4 of http://www.st.com/resource/en/datasheet/stm32f071v8.pdf WLCSP-63, 7x9 raster, 3.228x4.164mm package, pitch 0.4mm; see section 7.5 of http://www.st.com/resource/en/datasheet/DM00284211.pdf WLCSP-104, 9x12.

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